Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ DTA114YM
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ DTA114YM
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- DTA114YM
- Electronic Component
- 1
- Package
- SOT-723
- Electronic Component
- 1 PNP
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0264879496
- Operating Temperature
- 55℃~+150℃
- Resistor
- 4.7
- Resistor
- 10kΩ
- Transistor Type
- PNP
- Frequency(f T)
- 250MHz
- Power Dissipation(Pd)
- 100mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DTA114YM 产品概述
一、型号简介
DTA114YM 是 CJ（长晶/长电）推出的一款预偏置（Pre‑biased）PNP 数字晶体管，封装为极小的 SOT‑723，适合空间受限的表贴电路。器件针对低压逻辑驱动和开关应用进行了内置电阻设计，简化外围电路，便于与 MCU、逻辑门及光电元件直接接口。
二、主要电气参数
- 晶体管类型：PNP（预偏置）
- 集射极击穿电压 Vceo：50 V
- 集电极允许电流 Ic：70 mA（最大）
- 最大耗散功率 Pd：100 mW
- 直流电流增益 hFE：≈68（典型）
- 特征频率 fT：250 MHz（高频开关性能良好）
- 工作温度范围：-55 ℃ ~ +150 ℃
- 封装：SOT‑723（超小型）
三、输入/输出与内置电阻特性
- 内置输入电阻：约 10 kΩ，电阻比率约 4.7（便于形成预偏置分压）
- 输入电压门槛：VI(on) 在不同测试条件下有标称值（如 1.4 V @ 1 mA，或其它条件下 0.3 V）；VI(off) 在 100 µA 时约 300 mV，最高到 5 V（请参考详细数据手册以确认测试条件）
- 输出饱和电压：VO(on) 典型 300 mV @ 5 mA；在微小电流（0.25 mA）时约 0.25 mV（请注意具体测试条件）
这些预偏置特性使器件在逻辑驱动时无需外接基极限流电阻或只需很小的外部元件即可实现稳定开关。
四、应用场景与设计要点
适用场景包括高侧/低侧小电流开关、LED 驱动、逻辑电平转换、接口保护和板载复位/使能电路等。设计时注意：
- 虽然 Ic 可达 70 mA，但受限于 Pd=100 mW 及 SOT‑723 散热能力，建议在较高电流工作时做好热管理或限制占空比。
- 内置 10 kΩ 电阻简化了驱动电路，但当外部信号源或噪声较强时，仍建议加入滤波或保护电路。
- 由于为 PNP 型，常用于正电源侧开关，连接时注意极性与参考地的关系。
- 高频特性（fT=250 MHz）适合快速开关，但驱动与走线需注意寄生电容与阻抗匹配。
五、封装与选型建议
SOT‑723 超小封装适用于空间受限的便携或密集电路板。选型时请结合实际电流、功率与温升条件，并参照 CJ 提供的完整器件数据手册与功率热特性曲线，确保在安全工作区内使用。
总结：DTA114YM 以其预偏置、微型封装与良好的开关性能，适合低功耗、体积受限的数字开关和接口应用，但在高电流或高功耗场合需慎重考虑热耗与散热设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
