WMSIC Electronic Components

CJ ESDBL3V3D5

ModelESDBL3V3D5
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ ESDBL3V3D5
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
ESDBL3V3D5
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.012g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
15pF
Electronic Component
BM0235662494
Operating Temperature
55℃~+150℃
Voltage
10V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDBL3V3D5 TVS二极管产品概述

一、产品简介与定位

ESDBL3V3D5 是 CJ(江苏长电/长晶)推出的一款单路双向瞬态电压抑制(TVS)二极管,封装为小型 SOD-523,专为 3.3V 工作电压的接口与电源线提供 ESD 及浪涌保护。器件类型为 ESD 防护元件,满足 IEC 61000-4-2 静电放电防护要求,适合移动设备、消费电子、通信模块及各种接口保护应用。

二、主要电气参数(关键指标)

  • 极性:双向(适用于有正负瞬态的信号线)
  • 反向截止电压 Vrwm:3.3V(推荐用于 3.3V 系统)
  • 击穿电压 Vbr:6V(典型)
  • 钳位电压 Vclamp:10V(在 8/20µs 浪涌条件下)
  • 峰值脉冲电流 Ipp:7A @ 8/20µs
  • 峰值脉冲功率 Ppp:70W @ 8/20µs
  • 反向电流 Ir:400nA(低漏电流,有利于节能与高阻抗电路)
  • 结电容 Cj:15pF(中等电容,适合多数数字信号线)
  • 通道数:单路
  • 工作温度:-55℃ ~ +150℃
  • 封装:SOD-523(极小尺寸,便于贴片布局)

三、应用场景与性能优势

该器件适用于 3.3V 电源轨、GPIO、串行总线、差分/单端信号线、射频模块接口等场景。双向结构能有效钳制正负方向的瞬态电压;较低的漏电流保证在待机或低功耗模式下对系统影响最小;15pF 的结电容在多数控制与通信线路上不会引入明显失真,但对超高速差分接口(例如多吉比以太网或高速串行链路)需按具体带宽评估。

四、封装与使用建议

SOD-523 小封装便于在空间受限的板级保护中使用,建议将器件尽可能靠近需保护的接口或连接器放置,以缩短走线和降低寄生电感。焊接时按厂家推荐的回流曲线操作,避免过热导致器件性能退化。对于频繁遭受高能量浪涌的应用,可串联限流电阻或配合更高能量等级的浪涌抑制器使用。

五、选型要点与注意事项

  • 若目标线路对信号完整性要求极高,应关注 Cj 的影响,必要时选用更低电容的 TVS 器件或在系统上测量时序与抖动。
  • 3.3V 系统选型时,Vrwm 与系统最大工作电压需匹配,避免误触发或无法有效钳制。
  • 对于长期可靠性,关注器件在高温与高湿环境下的老化特性及封装可靠性。
  • 参考应用:消费电子接口、工业控制信号线、通信模块外部引脚、板级 ESD 测试点等。

总结:ESDBL3V3D5 以其小封装、双向保护、低漏电与中等结电容,在 3.3V 系统的板级 ESD/浪涌防护中提供了平衡的性能与成本,是常见的通用级保护选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.