WMSIC Electronic Components

CJ BZT52B18

ModelBZT52B18
PackageSOD-123
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZT52B18
Type
CJ
Minimum package
3000

Technical parameters

Electronic Component
CJ
Electronic Component
BZT52B18
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
225Ω
(Zzt)
45Ω
Electronic Component
BM0228679562
Diode
1
Power Dissipation(Pd)
350mW
Electronic Component
17.64V~18.36V
Electronic Component
55℃~+150℃
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B18 产品概述

一、产品简介

BZT52B18 为独立式稳压(二极管)器件,品牌为 CJ(江苏长电/长晶),封装为 SOD-123。该器件在反向工作状态下提供约 18V 的稳压特性,适用于低功耗、小体积的基准/稳压场合,可作为简单的电压基准、过压钳位或偏置源使用。

二、主要参数

  • 标称稳压值:18V
  • 稳压位范围:17.64V ~ 18.36V(典型测试范围)
  • 反向电流 Ir:100nA @ 12.6V(漏电流指标)
  • 阻抗:Zzk 225Ω(在指定测试条件下的直流/低频阻抗),Zzt 45Ω(在指定测试条件下的交流/动态阻抗)
  • 最大耗散功率 Pd:350mW(需注意结温与环境降额)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SOD-123(表面贴装,适合自动化贴装与回流焊工艺)

三、典型应用

  • 小型稳压电源与基准电压源(低功耗场合)
  • 输入过压或浪涌钳位保护(与限流元件配合)
  • 模拟电路偏置、参考电压提供
  • 便携设备、传感器模块与便携式测量仪器中的低功耗稳压

四、使用与注意事项

  • 功耗与热管理:Pd 为 350mW,为保证器件长期可靠性,应在 PCB 设计中提供足够的散热路径并按数据表对结温进行降额计算。若通电工作于高电压或较高电流条件下,应确认结温不超限。
  • 测试与测量:测量稳压值时应在规定测试电流下读取 Vz,同时测量漏电流 Ir 时要在指定电压点(如 12.6V)读取。动态阻抗随测试电流不同而变化,实际电路中应关注工作电流对应的阻抗特性。
  • 焊接工艺:SOD-123 支持回流焊,推荐遵循厂商推荐的回流温度曲线,避免过高峰值温度和长时间回流以防损伤器件或影响稳定性。
  • 极性及防静电:稳压二极管有明确极性,安装前确认方向;做好防静电措施以保护器件免受静电损伤。

五、封装与可靠性

SOD-123 封装体积小,适合高密度 PCB 布局。长期可靠性与电气特性依赖于工作结温与环境应力,正常环境下遵循资料温度范围及功率降额规则,可获得稳定的电压参考性能。

六、选型与订购建议

选择时除了稳压电压与功耗外,还应关注在目标工作电流范围内的动态阻抗与温度系数,以及漏电流对电路的影响。CJ(江苏长电/长晶)BZT52B18 在小型低功耗应用中具有成本与体积优势,适合批量贴片生产。订购时请注明封装 SOD-123 与相关测试批次/可靠性要求,以便获取对应质量与测试报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.