WMSIC Electronic Components

CJ US1D

ModelUS1D
PackageSMAG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ US1D
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
US1D
Electronic Component
1
Package
SMAG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.111g
Electronic Component
1
Electronic Component
BM0235664162
Current
1A
Diode
1
Current(Ir)
5uA
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US1D 高效率整流二极管 产品概述

一、概述

US1D 是 CJ(江苏长电/长晶)推出的高效率整流二极管,封装为 SMAG。器件针对通用整流与开关电源应用优化,兼顾低正向压降与快速恢复特性,适用于要求低损耗和抗浪涌能力的电源电路。

二、主要参数

  • 正向压降(Vf):1.3V @ IF = 1.0A
  • 直流反向耐压(Vr):200V
  • 连续整流电流:1A
  • 反向电流(Ir):5µA(典型/最大条件请参见数据手册)
  • 反向恢复时间(Trr):50ns
  • 工作结温范围:-55℃ ~ +150℃
  • 非重复峰值浪涌电流(Ifsm):30A
  • 封装:SMAG;品牌:CJ(江苏长电/长晶)

三、产品特点与优势

  • 低正向压降:在 1A 工作点上 Vf 仅 1.3V,减小导通损耗,提高整机效率。
  • 快速恢复:Trr = 50ns,有利于降低开关损耗与开关时产生的过冲/电磁干扰,适合开关电源和 PWM 应用。
  • 低反向泄漏:Ir = 5µA,有助于高阻抗或高压回路的静态性能。
  • 良好浪涌承受:Ifsm=30A,能应对启动或短时故障时的脉冲电流。
  • 宽温区稳定:-55℃~+150℃ 满足工业级温度要求。

四、典型应用

  • 开关电源(SR 二极管、整流)
  • 充电器与适配器输出整流
  • 电机驱动与再生能量回收
  • 极性保护、反向保护与续流二极管
  • 各类消费电子与工业电源模块

五、设计与使用建议

  • 布局:SMAG 封装依赖良好铜箔散热,建议在 PCB 焊盘处使用适量铜箔或过孔散热至内部/底层。
  • 热限流:在高温或连续 1A 附近工作时应进行适当降额与散热设计,确保结温不超过额定值。
  • 开关速率:Trr=50ns 适用于中高速开关应用;在极高频(多MHz)场合需评估反向恢复引起的损耗与振铃。
  • 焊接:遵循厂家推荐的回流曲线与峰值温度,避免超温导致性能退化或失效。
  • 极性识别:器件有端带标记,请按数据手册确认阴阳极方向以免损坏电路。

六、选型与可靠性

选择 US1D 时,请参考完整数据手册以获取典型曲线(Vf vs IF、Ir vs VR、Trr 测试条件等)与钳位/浪涌能量相关信息。对于关键可靠性场合,建议进行样机验证,在目标温度和脉冲应力下验证寿命与热特性。

如需进一步的 PCB 焊盘建议、典型电路图或与同类器件的对比分析,我可以根据具体应用场景给出更详细的设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.