WMSIC Electronic Components

CJ BZX584C20

ModelBZX584C20
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584C20
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584C20
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.01g
Electronic Component
1
(Zzk)
225Ω
(Zzt)
55Ω
Electronic Component
BM0227654042
Diode
1
Current(Ir)
100nA@1V
Power Dissipation(Pd)
150mW
Electronic Component
18.3V~21.2V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C20 Y7(CJ 长电/长晶)— 产品概述

一、产品简介

BZX584C20 是一款低功耗、独立式稳压(齐纳)二极管,标称稳压值为 20V,CJ(江苏长电/长晶)生产,封装为超小型 SOD-523。该器件适合在空间受限、功耗要求低的便携和消费电子中用作基准/稳压、浪涌吸收与钳位保护等功能。

二、主要电气参数

  • 标称稳压值(Vz):20V(典型值)
  • 稳压值范围:18.3V ~ 21.2V(表示零件批次与工作条件下可能的偏差)
  • 反向漏电流 Ir:100nA @ 1.0V(在 1.0V 反向电压下的漏电)
  • 耗散功率 Pd:150mW(器件在环境温度和 PCB 散热条件下的最大允许耗散)
  • 稳压阻抗 Zzt:55Ω;稳压膝阻抗 Zzk:225Ω(表征在测试电流与低电流时的动态阻抗差异)
  • 工作结温范围:-55℃ ~ +150℃

注:Zzt 与 Zzk 的差值提示该器件在较高测试电流下稳压特性优于在微安级电流下的稳压性能,低电流时稳压精度下降。

三、封装与热管理

SOD-523 为非常小的表贴封装,适合高密度 PCB 布局,但热阻较大,散热受限。基于 Pd=150mW,理论上器件在稳压 20V 时的最大连续稳压电流约为 0.15W / 20V ≈ 7.5mA。实际应用应考虑环境温度、PCB 铜箔面积和旁路元件,必要时对器件电流进行限制或采用并联/替代件以保证可靠。

PCB 布局建议:

  • 尽量缩短引脚走线,增大与散热铜箔的连接面积;
  • 若可能,在器件底部开敷铜或加热沉以改善散热;
  • 保持周围无散热敏感器件并避免热源直射。

四、典型应用场景

  • 低功耗稳压参考:为模拟电路或供电子系统提供近似 20V 的基准/钳位,适合电流预算严格的场合。
  • 过压保护/钳位:用于输入端或信号线上限制瞬态电压,保护后级电路。
  • 电平移位:在需要将电压钳位到约 20V 的场合作简单电平限定。
  • 测试与测量设备:作为参考或保护元件使用,前提为满足功耗与精度要求。

五、使用建议与注意事项

  • 功率限制:严格按最大耗散功率设计电路,长期工作电流建议远低于理论极限(7.5mA),以延长寿命并降低温升。
  • 工作电流区间:若电路常处于微安级电流,注意稳压值会偏离标称(Zzk 较大),应在电路中保证足够的偏流或选择测试条件下稳定度更好的件型。
  • 温度影响:高温下器件稳压值和漏电会变化,关键应用需做温度范围内的验证。
  • 焊接工艺:SOD-523 为小型封装,推荐使用回流焊并遵守厂商热循环规范,避免过热或长时间保温导致封装应力。

六、选型与替代建议

在需要更高功率或更低动态阻抗时,可考虑封装更大、Pd 更高的齐纳二极管或集成稳压芯片;若要求更精确电压基准,建议选择低温漂、低噪声的专用基准源。选型时应综合考虑:稳压精度、工作电流、功耗、封装空间与成本。

七、存储与可靠性

  • 存储环境宜干燥、无腐蚀性气体,避免长时间受潮,高温或强光直射。
  • 在制程与装配中注意静电防护(ESD),小型封装器件对机械应力敏感,避免强挤压或弯折。

总结:BZX584C20 Y7 以其小体积和合理的稳压特性,适合对空间与成本敏感且功耗要求较低的应用场景。在设计时需重视功耗与热管理、工作电流区间以及温度对稳压特性的影响,以确保稳定可靠运行。若需更高精度或更大功耗能力,请在选型阶段做相应权衡或选用替代器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.