WMSIC Electronic Components

CJ RS3M

ModelRS3M
PackageSMBG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ RS3M
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
RS3M
Electronic Component
1
Package
SMBG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.312g
Electronic Component
1
Electronic Component
BM0227310092
Current
3A
Diode
1
Current(Ir)
10uA@1kV
(Vf)
1.3V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS3M 产品概述

RS3M 是一款独立式快恢复/高效率整流二极管,出自品牌 CJ(江苏长电/长晶),封装为 SMBG。器件针对中功率、高压整流与开关电源应用进行了优化,兼顾快速恢复特性与较低正向压降,适合工业与消费类电源系统中的整流与续流保护场合。

一、主要电气参数

  • 型号:RS3M(CJ)
  • 封装:SMBG(独立式)
  • 额定整流电流:3A(连续)
  • 正向压降(Vf):1.3V @ 3A
  • 直流反向耐压(Vr):1000V
  • 非重复峰值浪涌电流(Ifsm):100A
  • 反向电流(Ir):10μA @ 1000V
  • 反向恢复时间(Trr):500ns
  • 工作结温范围:-55℃ ~ +150℃(Tj)

二、器件特点与优势

  • 高耐压:1000V 的反向耐压使 RS3M 适用于高压整流与高压开关电源,满足一次侧整流及高压逆变链路需求。
  • 快恢复性能:500ns 的反向恢复时间在降低开关损耗与提升转换效率方面表现良好,适合中频开关(数十至数百 kHz)应用。
  • 低反向漏流:在最高额定电压下仅约 10μA 的反向电流,有利于减少静态损耗与高压漏电问题。
  • 较强浪涌能力:100A 的单脉冲浪涌能力可应对启动冲击或短时过载情形,提高系统鲁棒性。
  • 适用封装:SMBG 封装便于通用 PCB 装配与热管理设计,利于自动化贴装与波峰/回流焊工艺。

三、典型应用场景

  • 开关电源(SMPS)一次侧整流或续流二极管
  • 逆变器与电机驱动的续流与自由轮回路
  • 通用整流模块、高压电源与电池充电器
  • 工业控制设备、照明电源与太阳能逆变链路中的高压整流

四、设计与使用建议

  • 热管理:Vf=1.3V @3A 对应约 3.9W 的导通损耗,持续工作时需做好散热(合理铜箔面积、散热片或风冷),并在版图上优化热回流路径。
  • 电流与温度退让:在高环境温度与靠近额定电流工作时,应进行电流降额以保证结温不超限,延长寿命与可靠性。
  • 开关瞬态处理:500ns 的反向恢复在高 dv/dt 场合可能引起电磁干扰或尖峰,应根据系统要求考虑吸收网络(RC、RCD 抑制)或适当的缓冲措施以减少尖峰电压。
  • 浪涌保护:尽管 Ifsm=100A 具备良好瞬态承受能力,但在频繁冲击或严重短路条件下仍应提供过流保护与保护电路。
  • PCB 布局:确保二极管与相关散热器件之间的热阻最低,正负端焊盘与走线足够宽以降低导通损耗并避免热集中。

五、总结

RS3M(CJ,SMBG 封装)是一款面向高压中功率整流的快恢复二极管,兼顾 1kV 耐压、500ns 快恢复与 3A 连续电流能力,适合多种工业与电源应用。设计时需重视导通损耗产生的热量与反向恢复带来的瞬态影响,通过合理的散热与抑制措施,可在系统中发挥稳定且高效的整流与保护作用。若需进一步的详细电气特性曲线或热阻参数,可参考厂商完整数据手册以完成精确的热与电路设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.