WMSIC Electronic Components

CJ ES5G

ModelES5G
PackageSMCG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ ES5G
Type
CJ
Minimum package
3000

Technical parameters

Electronic Component
CJ
Electronic Component
ES5G
Electronic Component
1
Package
SMCG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.34g
Electronic Component
1
Electronic Component
BM0264338865
Current
5A
Diode
1
Current(Ir)
10uA@400V
(Vf)
1.25V@5A
Electronic Component
55℃~+150℃
Electronic Component
3000
Voltage Rating(Vr)
400V
(Trr)
35ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES5G 超快恢复整流二极管产品概述

ES5G是江苏长电(CJ)推出的一款超快恢复整流二极管,专为高频电力电子系统设计,具备低正向压降、高耐压、快恢复等核心特性,广泛应用于开关电源、逆变器等对效率和可靠性要求较高的场景。

一、产品定位与核心价值

作为超快恢复系列器件,ES5G区别于普通整流管(反向恢复时间通常为微秒级),主打高频适配性和低损耗:

  • 反向恢复时间仅35ns,可大幅降低开关过程中的损耗与EMI辐射;
  • 低正向压降减少导通功耗,提升系统整体效率;
  • 宽温、抗浪涌设计满足工业级可靠性需求。

二、关键电气参数解析

1. 正向特性

  • 正向压降(Vf):1.25V@5A(额定电流)
    低Vf意味着导通时功耗极小(P=Vf×I),可降低电源系统的散热需求,提升效率(如开关电源效率可提升1%-2%)。

2. 反向特性

  • 直流反向耐压(Vr):400V
    满足多数中高压系统需求(如220V交流整流后直流约310V,留有余量),适配12V/24V/48V升压后的逆变器、充电桩等场景;
  • 反向电流(Ir):10μA@400V
    低漏电流确保反向阻断时损耗可忽略,提升系统待机可靠性。

3. 电流能力

  • 额定整流电流(Io):5A(连续)
    覆盖中小功率电力电子系统的持续负载需求;
  • 非重复峰值浪涌电流(Ifsm):150A(8.3ms正弦半波)
    可承受开机浪涌、负载突变等瞬间大电流冲击,减少系统因浪涌损坏的风险。

4. 恢复特性

  • 反向恢复时间(Trr):35ns
    属于超快恢复级别,适配几十kHz至上百kHz的高频应用(如高频开关电源、感应加热设备),避免普通管因恢复慢导致的开关损耗剧增。

三、封装与品牌保障

1. 封装形式:SMCG

SMCG为小型化表面贴装封装,特点包括:

  • 尺寸紧凑,适合高密度PCB设计(如LED驱动电源、笔记本电源);
  • 自动化贴装效率高,降低生产制造成本;
  • 陶瓷/塑料复合封装具备良好散热性能,配合宽结温设计适应高负载场景。

2. 品牌优势:CJ(江苏长电)

长电科技是国内半导体封装测试龙头,ES5G符合RoHS无铅标准,经过严苛的可靠性测试(如高温老化、温度循环),批次一致性好,广泛应用于工业、汽车(部分系列)、消费电子领域。

四、工作环境与可靠性设计

  • 结温范围:-55℃~+150℃
    覆盖工业级宽温需求,适合户外充电桩、电动车控制器、机房UPS等温差较大的场景;
  • 封装可靠性:抗振动、耐冲击设计,适配车载、工业设备等振动环境;
  • 参数稳定性:长电的工艺控制确保不同批次器件参数偏差极小,降低系统设计调试难度。

五、典型应用场景

  1. 开关电源次级整流:PC电源、LED驱动电源、适配器等,高频开关下减少损耗,提升效率;
  2. 逆变器系统:太阳能逆变器、电动车逆变器,DC-AC转换中适配中高压需求;
  3. UPS不间断电源:市电切换时的整流/续流,抗浪涌能力应对切换冲击;
  4. 电动车充电模块:充电桩AC-DC转换,宽温适应户外温差;
  5. 高频感应加热:几十kHz工作频率下,快恢复特性提升加热效率。

总结

ES5G凭借超快恢复(35ns)、低导通损耗(1.25V@5A)、高耐压(400V)、强浪涌(150A)、宽温(-55~150℃) 等核心优势,结合长电的品牌可靠性,成为高频电力电子系统中次级整流、续流等场景的高性价比选择,适合对效率、稳定性有要求的工业及消费电子应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.