Model & package intelligence
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CJ 1SS404
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 1SS404
- Type
- CJ
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 1SS404
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Electronic Component
- BM0228274048
- Current
- 300mA
- Diode
- 1
- Current(Ir)
- 50uA@20V
- (Vf)
- 450mV@300mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SS404 肖特基二极管（CJ/江苏长电）产品概述
一、产品简介
1SS404 为江苏长电（CJ/长晶）生产的小功率肖特基整流二极管，封装为 SOD-323。凭借肖特基结构的低正向压降与快速恢复特性，适合便携式电子设备中低压、大电流脉冲或高频整流场合。典型标称参数包括：正向压降 Vf = 450 mV @ 300 mA、直流正向整流电流 IF = 300 mA、直流反向耐压 Vr = 20 V、反向电流 Ir = 50 μA @ 20 V，非重复峰值浪涌电流 Ifsm = 700 mA（短时脉冲）。
二、主要电气参数解析
- 正向压降 450 mV@300 mA：在 300 mA 工作点上具有较低压降，可降低功耗与热耗，有利于电源效率提升。实际 Vf 会随电流变化，设计时应查阅完整 I–V 曲线。
- 反向耐压 20 V：适用于低压轨（如 5V、3.3V、12V 以下）系统的整流与保护，不能用于高压应用。
- 反向电流 50 μA@20V：在高温下 Ir 会增大，需在高温或泄漏敏感的电路中注意热漂移影响。
- 峰值浪涌 700 mA：仅适用于短时非重复浪涌；长期或重复冲击需额外评估或并联保护。
三、封装与热管理
SOD-323 为小型表面贴装封装，适合空间受限的 PCB 布局。由于封装体积小，热阻较大，持续大电流工作时需注意热量集中。推荐在散热要求较高的场合采用短的走线、增大铜箔面积或在电源回路处并联热铜铺，必要时结合热 vias 进行散热。
四、典型应用场景
- 便携式电源与充电电路中的低压整流与反向保护
- DC-DC 降压转换器的二次侧整流或续流回路（低电流方案）
- 信号钳位、浪涌抑制与吸收小幅反向脉冲
- 高速开关电路中作为恢复快、损耗低的整流元件
五、设计与布局注意事项
- 避免在超过额定 Vr 的环境下长期反向偏置，注意反向泄漏和温升。
- 峰值浪涌 Ifsm 为短时参数，设计应保证浪涌能量在器件承受范围内。
- PCB 布局上尽量缩短正负极之间走线，减少阻抗与热阻，焊盘按制造商推荐尺寸进行设计并遵循回流焊曲线。
- 对温漂敏感的电路，应在预期工作温度下验证 Ir 与 Vf 的变化。
六、可靠性与封装注意
SOD-323 小外形利于高密度组装，但对焊接工艺与湿度敏感性（MSL）有严格要求。建议按照厂商数据手册中的焊接温度曲线、存储及回流注意事项执行，以保证焊接可靠性与长期性能稳定。
七、选型与替代建议
1SS404 适合低压、低功耗场景，若需更高耐压或更低漏电流，可考虑耐压更高或漏电更小的肖特基型号；若需承受更大持续电流或散热更好，应选择更大封装或功率器件。最终选型建议基于完整数据手册验证温度、电流波形与可靠性需求。若需数据手册或 PCB 封装图，可进一步提供，我将协助查阅与校核。
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