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CJ 1SMA5930A
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 1SMA5930A
- Type
- CJ
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 1SMA5930A
- Electronic Component
- 1
- Package
- SMAG
- Electronic Component
- Zener Diode
- Electronic Component
- 0.111g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 10Ω
- Electronic Component
- BM0226984281
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- 15.2V~16.8V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA5930A 产品概述
一、产品简介
1SMA5930A 为 CJ（江苏长电/长晶）生产的稳压二极管，标称稳压值 16V（允许范围 15.2V～16.8V），采用 SMAG 表面贴装封装，适用于低功耗稳压、基准电压和浪涌/瞬态钳位场合。器件工作结温范围宽 (-55℃～+150℃)，适应工业级环境。
二、主要电气参数
- 稳压值（标称）: 16V；稳压范围: 15.2V ～ 16.8V（器件在规定测试电流下测得）。
- 反向电流 Ir: 500 nA @ 12.2V（注意该泄漏电流在 12.2V 下测得，16V 下可能更高，应按厂方曲线评估）。
- 耗散功率 Pd: 1.5 W（额定耗散功率，实际应用中需考虑 PCB 散热与降额）。
- 阻抗参数: Zzk = 600 Ω（低电流拐点/膝部阻抗，表征在拐点附近电压对电流的敏感性）；Zzt = 10 Ω（稳态动态阻抗，在规定测试电流附近的微分阻抗，反映调节能力）。
三、热与功耗管理
Pd=1.5W 为器件最大耗散能力，实际使用时必须保证结温 Tj 不超过 +150℃。由于小封装散热受限，建议：
- 在持续稳压场合对功率进行降额（常见做法保持实际耗散 ≤ Pd 的 50%～70%），
- 计算或参考厂方的 RθJA（结—环境热阻）以估算允许的环境温度和电流，
- 提供足够的铜箔散热或使用热过孔改善 PCB 散热。
四、封装与安装
SMAG 表面贴装，适合自动贴装与回流焊工艺。布板建议：
- 增大焊盘铜面积以改善散热，
- 在高功率或需快速散热场合布置热过孔连底层铜箔，
- 保证焊接工艺参数符合厂方回流曲线，避免因温度循环影响可靠性。
五、典型应用场景
- 低功耗 16V 参考源与偏置电路；
- 小功率保护与浪涌钳位（瞬态抑制）；
- 工业电子、通信终端及汽车电子次级保护（需核对工作温度与可靠性要求）。
六、选型与注意事项
- 若用于精密基准，请注意 Zzk 较大，低电流工作状态下稳压点可能不够陡峭，应确保工作电流在能体现低 Zzt（≈10 Ω）的范围内；
- 反向电流规格在 12.2V 测得，若应用在 16V 长期偏压下，应向厂方索取 Ir-V 曲线或做自测以确认泄漏与温漂；
- 对浪涌或脉冲电流场合，确认瞬态能量承受能力并按需增加串联限流或配合 TVS 器件使用。
七、可靠性与测试建议
在产品验证阶段建议做温度循环、稳态老化和实际 PCB 上的长时间功耗测试，重点关注结温、稳压漂移和泄漏电流随温度的变化。若需更详细的电气特性曲线与热参数，请参考厂方数据手册或联系 CJ 技术支持。
总结：1SMA5930A 以 16V 标称稳压、SMAG 小封装与 1.5W 额定耗散定位于小功率稳压与保护场合。合理的电流设置与散热设计是保证长期稳定性的关键。
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