WMSIC Electronic Components

CJ CJAC130SN06L

ModelCJAC130SN06L
PackagePDFNWB5×6-8L-B
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJAC130SN06L
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CJAC130SN06L
Electronic Component
1
Package
PDFNWB5×6-8L-B
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.137g
Electronic Component
1
Electronic Component
BM0226580910
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
130W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
60V
Capacitor(Ciss)
3.56nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJAC130SN06L 产品概述

一、产品简介

CJAC130SN06L 是江苏长电(CJ/长晶)推出的一款高电流、低导通电阻的 N 沟增强型 MOSFET,额定漏源电压 60V,适用于需要大电流、低损耗的功率开关场合。工作温度范围宽(-55℃ ~ +150℃),单个器件即可承受高达 130A 的连续漏极电流(在适当散热条件下),适合开关电源、同步整流、功率分配和电机驱动等应用。

二、关键电气参数

  • 漏源耐压(Vdss):60V
  • 连续漏极电流(Id):130A(注:受封装及PCB散热限制)
  • 导通电阻(RDS(on)):3.5mΩ @ Vgs=4.5V, Id=20A;2.6mΩ @ Vgs=10V(更高驱动电压下可获得更低导通损耗)
  • 门阈电压(Vgs(th)):1.6V
  • 总栅极电荷(Qg):66.4nC @ Vgs=10V(开关驱动需考虑驱动能力)
  • 输入电容(Ciss):3.56nF @ 30V;反向传输电容(Crss):82pF @ 30V
  • 功耗耗散(Pd):130W(热阻与PCB布局关系密切)
  • 封装:PDFNWB5×6-8L-B(带大热引脚,有助于散热与可靠焊接)

三、核心优势

  • 低导通电阻:在10V驱动下仅约2.6mΩ,大幅降低导通损耗,提升效率。
  • 高频开关能力:中等 Ciss 与较小 Crss,有助于减小开关能量损失和提升转换效率。
  • 宽温度与大电流能力:-55℃ 至 +150℃ 的工作温度范围与高达 130A 的额定电流,适合严苛工作环境和高功率应用。
  • 封装优化散热:PDFNWB5×6-8L-B 封装配合底部热垫与大面积铜箔,可实现良好热管理。

四、典型应用场景

  • 同步整流与降压(Buck)转换器的低侧/高侧开关
  • 电源管理与功率分配开关(高电流负载断路)
  • 电机驱动前级开关、倒车/踏板负载切换
  • 高效逆变器与功率因数校正(PFC)前端

五、设计与使用建议

  • 驱动要求:Qg=66.4nC,建议使用能提供足够电流的门极驱动器,若要求最快切换可配合适当门阻(Rg)以抑制振铃并控制开关过渡。
  • 散热处理:尽量使用大面积铜箔、充足过孔(热 vias)与底部热焊盘,以降低结-环境热阻,确保在高电流工作下器件温升受控。Pd 标称值需结合 PCB 热设计进行实际计算。
  • 抗过冲保护:在有感性负载时建议并联 TVS 或 RC 缓冲,或在驱动回路中使用斜坡控制,防止 Vds/Id 峰值导致应力过大。
  • 并联使用:若需并联多颗器件,应确保良好一致的 PCB 路径与电流分配,并考虑每颗器件的温度补偿。
  • 静电与装配:遵循常规 ESD 防护,焊接时参考封装厂商的回流曲线与焊盘推荐,确保焊接质量与热接触。

六、采购与包装信息

  • 品牌:CJ(江苏长电/长晶)
  • 型号:CJAC130SN06L
  • 封装:PDFNWB5×6-8L-B
  • 数量:1个(单件采购或按需批量订购)

如需进一步热阻/封装视图、典型开关波形或在特定电路中的效率曲线,建议参考器件详尽的 Datasheet 或与供应商联系获取完整电气模型和 PCB 设计指导。

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