WMSIC Electronic Components

CJ US3M

ModelUS3M
PackageSMBG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ US3M
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
US3M
Electronic Component
1
Package
SMBG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.208g
Electronic Component
1
Electronic Component
BM0228054891
Current
3A
Diode
1
Current(Ir)
10uA@1000V
(Vf)
1.7V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US3M 二极管(CJ/长电 · SMBG)产品概述

一、产品简介

US3M 是江苏长电(CJ/长晶)推出的一款通用整流/开关二极管,封装为 SMBG,面向中等功率、高电压的整流和保护场合。产品归类暂为“未分类”,但凭借 1kV 的反向耐压与 3A 的整流能力,适用于电源整流、续流保护、输入防护及工业电子等多种场景。

二、主要电气参数

  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 正向压降(Vf):1.7 V @ 3 A
  • 额定整流电流:3 A(持续)
  • 非重复峰值浪涌电流(Ifsm):100 A
  • 直流反向耐压(Vr):1000 V
  • 反向电流(Ir):10 μA(在额定 Vr 条件下典型/上限)
  • 反向恢复时间(Trr):75 ns

三、封装与机械特性

US3M 采用 SMBG 表面贴装封装,体积小、安装方便,适合自动贴装与回流焊工艺。SMBG 封装在散热面积上受限,因此在 3 A 持续工作时需要注意 PCB 散热设计与环境温升控制,以保证结温不超过最大额定值。

四、主要特性与优势

  1. 高电压耐受:1000 V 的 Vr 使其适合中高电压电源、逆变器及电网侧应用。
  2. 良好浪涌承受能力:100 A 的 Ifsm 可应对开机浪涌或短时脉冲冲击,增强系统抗冲击能力。
  3. 中等开关速度:Trr≈75 ns,适合一般开关电源与续流应用;既比慢恢复整流器快,也无快速恢复器带来的高频噪声问题。
  4. 容易装配:SMBG 封装兼容常见 SMT 工艺,利于批量生产与自动化装配。
  5. 品牌与供应:来自 CJ(江苏长电/长晶),具有成熟的制造与供应链背景。

五、典型应用场景

  • 开关电源整流桥或输出二极管(中等频率)
  • 功率适配器、充电器的高压侧整流
  • 电机驱动中的过电压吸收与续流保护
  • 工业电源、仪器仪表的高压整流与保护电路
  • 逆变器/光伏并网系统的防逆流或旁路保护(视系统要求)

六、使用与设计建议

  • 热设计:在 3 A 持续工作时,正向压降 1.7 V 对应的功耗约为 5.1 W(P = Vf × I),需通过扩大铜箔散热面积、加散热片或提升自然/强制对流散热来控制结温,避免长期在高结温下工作。
  • 浪涌与可靠性:Ifsm=100 A 表明短时浪涌能力较强,适用于容忍开机浪涌的应用,但建议评估实际浪涌能量并配合熔断保护或限流措施。
  • 反向恢复:Trr=75 ns 为中等恢复时间,若在高频(>100 kHz)开关电源中使用,应评估由反向恢复引起的电磁干扰与开关损耗,必要时加缓冲网络或选用更快/更慢的类型。
  • 反向泄漏与温度关系:标称 Ir=10 μA,在高温或高压下可能上升,关键设计应考虑漏电对系统静态功耗与偏置的影响。
  • 焊接工艺:遵循 SMBG 封装的回流焊温度曲线与 PCB 组装规范,避免超温或过长高温暴露影响器件可靠性。

七、存储与可靠性提示

器件应储存在干燥、避光、常温环境,避免潮湿导致回流焊时焊接缺陷;长期库存或在高湿环境下建议进行烘干处理再使用。建议在产品最终应用中遵循厂家详细数据手册进行更精确的热阻、极限参数与测试条件校核。

总结:US3M 以其 1kV 耐压、3A 整流和良好的浪涌能力,适合多类中高压电源与工业控制场景。设计时重点关注热管理与反向恢复引发的系统级影响,以保证长期可靠运行。若需更详细的电气特性曲线和封装机械图,请参考 CJ 官方数据手册。

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