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CJ BZX584C11
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C11
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C11
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzk)
- 150Ω
- (Zzt)
- 20Ω
- Electronic Component
- BM0227654051
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 10.4V~11.6V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C11 产品概述
一、产品简介
BZX584C11 为 CJ（江苏长电/长晶）生产的独立式稳压二极管，标称稳压值 11V，允许范围 10.4V ~ 11.6V。器件采用 SOD-523 表面贴装封装，体积小巧，适合空间受限和移动终端的低功耗应用。典型反向泄漏电流 Ir 为 100nA（在 8V 条件下测得），额定耗散功率 Pd 为 150mW，适用于小电流稳压和电压钳位场合。
二、主要电气参数
- 标称稳压值（Vz）：11V（范围 10.4V ~ 11.6V）
- 反向电流（Ir）：100nA @ 8V（低电流漏耗）
- 最大耗散功率（Pd）：150mW（器件热限制，应避免长期满载）
- 稳压阻抗：Zzt ≈ 20Ω（工作区动态阻抗）；Zzk ≈ 150Ω（低电流区）
- 封装：SOD-523（超小型贴片）
基于 Pd 计算的理论最大反向电流 Imax ≈ Pd / Vz ≈ 150mW / 11V ≈ 13.6mA。但考虑温升与可靠性，实际设计中应留安全余量，通常建议工作电流远低于该值（例如 ≤ 3–5mA）。
三、选型与电路设计建议
- 用途：低功耗基准、交流或直流电压钳位、信号截断、电源监测与保护等。
- 限流元件：稳压二极管需与串联电阻配合使用以限制电流。示例：若 Vin = 15V，希望 Iz ≈ 1mA，则 R = (15−11)V / 1mA = 4kΩ，R 功率 ≈ 4mW。
- 热管理：由于 SOD-523 封装散热有限，长时间或大电流工作应把耗散控制在 Pd 的 30%–50%以内以延长寿命并保持稳压精度。
- 抗干扰：稳压端并联去耦电容能改善瞬态响应与噪声性能，但要注意电容与回路稳定性。
四、封装与工艺注意
SOD-523 为超小型贴片，焊接时需控制回流曲线以防过热或引脚移位。装配注意防静电（ESD）和机械应力，元件体积小易受焊膏量和焊接湿润性影响，应在 PCB 布局阶段预留合适焊盘并验证回流可焊性。
五、应用注意事项
- 温度影响：泄漏电流与稳压点会随温度变化，温漂需在系统级评估。
- 保护与可靠性：避免长期在接近最大 Pd 条件下工作；若有较大功率或散热需求，考虑选用更高 Pd 或封装较大的型号。
- 测试建议：在目标工作电流与环境温度下测量 Vz、Ir 与动态阻抗，验证是否满足系统精度要求。
总结：BZX584C11 适合体积受限、低功耗的电压基准与保护场景，关键在于限流设计与热管理，合理的工作电流和装配工艺可以保证长期稳定性与良好性能。
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