Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ MMBT3906M
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MMBT3906M
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MMBT3906M
- Electronic Component
- 1
- Package
- SOT-723
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM69416523
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3906M三极管产品概述
一、产品基本信息
MMBT3906M 是一款由江苏长电（CJ）生产的NPN小信号晶体管，采用SOT-723封装。这款三极管的设计专注于高效、高性能的电子应用，广泛适用于各类信号处理及开关电路。
二、产品特性
封装形式：
- MMBT3906M 采用SOT-723微型封装，使其体积小巧，适合对空间有严格要求的电子产品设计。SOT封装的设计有效减少了电路板的面积和重量，这使得它在便携式设备和紧凑型电子产品中尤为受欢迎。
高的增益特性：
- MMBT3906M 的电流增益（hFE）范围通常在100到300之间，提供了优秀的放大能力，适用于信号放大器和其他需要高增益的应用场合。
工作电压范围：
- 该三极管的最大集电极-发射极电压（Vce）为40V，可以满足多个常见应用的需求，具有很好的耐压能力。
频率响应：
- MMBT3906M 的工作频率一般可达100MHz，适用于高频信号处理。这使得它成为高频电路、射频（RF）放大器和开关电路中的理想选择。
功耗和热性能：
- 其最高功耗可达到300mW，允许在高功率情况下稳定工作。同时，良好的热管理性能确保它在各种环境下正常运行。
三、应用领域
MMBT3906M 作为一种小信号三极管，广泛应用于以下领域：
信号放大器：
- 该三极管能够有效放大输入信号，使其在音频设备、电视接收器、无线电和其他音频信号处理设备中得到应用。
开关电路：
- MMBT3906M 适合用于开关电路中，能够快速切换状态，用于驱动负载，如继电器、灯光和风扇等。
数字电路：
- 在数字逻辑电路中，该三极管可作为开关元件，实现逻辑运算和数据存储。
无线通信：
- 这种三极管还适用于无线通信设备，如手机、对讲机等，能够保证良好的信号传输和处理。
消费电子：
- 适用于电视机、音响设备、游戏机等消费电子产品。
四、结论
MMBT3906M 是一款功能强大的小信号 NPN 三极管，凭借着其高增益、良好的频率响应以及优良的热管理性能，成为了众多电子产品设计中不可或缺的核心元件之一。其小巧的SOT-723封装设计，为诸多应用提供了灵活的集成方案。无论是在高频信号处理、开关控制还是数字电路中，MMBT3906M 均表现出色，广泛满足了现代电子设备对高性能和小型化的要求。对于需要性能可靠、性价比高的电子元件的设计工程师而言，MMBT3906M 绝对是一个值得考虑的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
