Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ 1SMA4734A
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 1SMA4734A
- Type
- CJ
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 1SMA4734A
- Electronic Component
- 1
- Package
- SMAG
- Electronic Component
- Zener Diode
- Electronic Component
- 0.1g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 5Ω
- Electronic Component
- BM0227661073
- Diode
- 1
- Current(Ir)
- 10uA
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA4734A 产品概述
一、产品简介
1SMA4734A 为 CJ（江苏长电/长晶）提供的稳压（二极管）器件，采用 SMAG 封装。该器件用于在反向偏置工作时提供稳定的参考电压和过压保护，常见于电源稳压、浪涌抑制及基准电路等场合。结构紧凑、可靠性高，适合集成电路板空间受限的应用。
二、主要参数
- 标称稳压值（Vz）：6.6 V
- 反向电流（Ir）：10 μA
- 耗散功率（Pd）：1 W（在规定散热条件下）
- 稳态阻抗（Zzt）：5 Ω
- 峰值/瞬态阻抗（Zzk）：600 Ω
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SMAG
三、关键特性与优点
- 稳压精度良好：在规定电流范围内提供稳定 6.6V 基准，适用于低功耗参考源。
- 低反向漏电：Ir 仅 10 μA，可在微弱电流条件下保持性能。
- 良好瞬态响应：较低的稳态阻抗（Zzt），在稳压工作点具备较好负载调节能力；Zzk 指示器件在瞬态冲击时的限制能力。
- 宽温度范围：适应工业级温度变化，适合恶劣环境使用。
- 体积小、封装标准化，便于自动贴装与批量生产。
四、主要应用场景
- 开关电源及线性稳压器的基准/保护电路。
- 通信设备、电池管理与便携设备的过压保护与稳压参考。
- 工业控制、仪表及汽车电子（需按系统级验证）中的低功耗稳压应用。
- 浪涌抑制或钳位用途，配合限流元件使用以保护敏感电路。
五、热管理与封装注意
SMAG 封装体积有限，Pd 为 1 W 时需关注印制板铜箔散热与环境温度。建议在设计时评估实际结温，采用适当的散热走线和散热面以保证长期可靠性，避免在高环境温度下连续满负荷工作。
六、使用与选型要点
- 选型时确认工作电流范围以确保在稳压区内工作，避免过低电流导致稳压偏移或过高电流超过耗散能力。
- 在做浪涌/瞬态保护时，应配合限流或缓冲元件以防止瞬态能量使器件过热损坏。
- 若用于汽车等关键场合，需在系统级做温度、冲击与老化验证。
七、采购与规格确认
采购时请核对 CJ 的完整规格书（Datasheet）以获取电流-电压特性曲线、温度系数、极限参数及封装尺寸。对可靠性或特殊要求（如特殊打标、批次一致性）可与供应商沟通确认。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
