Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ BZX584C4V3
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C4V3
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C4V3
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzt)
- 90Ω
- Electronic Component
- BM0227654045
- Diode
- 1
- Current(Ir)
- 3uA@1V
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 4V~4.6V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C4V3 产品概述
一、概述
BZX584C4V3 为独立式小功率稳压（二极管）器件，标称稳压值 4.3V，适合用于低功耗电路的基准与稳压、过电压钳位及偏置网络。该型号由 CJ（江苏长电/长晶）生产，封装为 SOD-523，体积小、适合高密度贴片场合。
二、主要参数
- 稳压值（标称）：4.3V；允许范围：4.0V ~ 4.6V。
- 反向电流 Ir：3 μA @ 1V（典型）；部分资料标注 5 μA @ 1V，可作为最大参考值。
- 动态阻抗 Zzt：90 Ω（在数据手册测试点条件下）。
- 最大耗散功率 Pd：150 mW（在规定散热条件下）。
- 工作结温范围：-55 ℃ ~ +150 ℃。
- 封装：SOD-523（表面贴装、超小型）。
说明：Zzt 与 Ir 表明该器件在低电流区表现为高阻抗，适用于微安至几毫安级别的稳压需求。
三、性能特点
- 小尺寸、低功耗：SOD-523 小型封装便于高密度板面布置，Pd=150mW 使其适合便携与低功耗应用。
- 稳压精度一般：4.3V 的标称与 4.0–4.6V 范围表明该器件并非精密参考，适合对稳压精度要求不高的场合。
- 低泄漏电流：Ir 在 μA 级别，对于漏电敏感电路影响较小。
- 较高的动态阻抗：Zzt=90Ω 提示稳压电压会随电流变化显著，宜在恒流源或小电流偏置下使用以获得相对稳定输出。
四、使用与设计建议
- 工作电流选择：理论上 Iz_max ≈ Pd / Vz ≈ 150mW / 4.3V ≈ 35 mA，但受封装散热限制，实际连续工作电流应远低于该值。建议常用工作电流在数毫安甚至更低，以保证热稳定性与可靠性。
- 热管理与降额：在高环境温度或有限散热条件下，应按厂商给出的功耗降额曲线调整最大允许功率，避免长时间接近 Pd。
- 电路布局：引脚走线要短且散热铜箔适度，以利于器件热量分散；保护电阻应按预期稳压电流计算并留有裕量。
- 对精度要求高的场合，应选用低阻抗、低温漂的参考源，或配合带温度补偿的电路使用。
五、封装与焊接注意
SOD-523 为超小型贴片封装，焊接时应采用推荐回流焊曲线并注意吸湿、回流次数限制。贴装与拆卸时避免机械应力，静电敏感器件，建议良好防静电措施。
六、典型应用
- 低功耗便携设备的局部稳压与参考源；
- 传感器与检测电路的偏置稳定；
- 数字接口的电平保护与钳位；
- 通用低功耗基准/稳压场合。
七、总结
BZX584C4V3 是一款面向低功耗、小尺寸应用的 4.3V 独立式稳压二极管，具有低漏电与小型化优势，适合微安至低毫安级稳压与钳位任务。由于动态阻抗较大和可用功耗受封装限制，设计时应关注工作电流、热降额与PCB散热条件，如需更高精度或更大功率，应选用专用参考源或更高功率封装的稳压器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
