WMSIC Electronic Components

CJ SK1015

ModelSK1015
PackageSMCG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ SK1015
Type
CJ
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
SK1015
Electronic Component
1
Package
SMCG
Electronic Component
Schottky Diode
Electronic Component
0.275g
Electronic Component
1
Electronic Component
BM0264584526
Current
10A
Diode
1
Current(Ir)
100uA@150V
(Vf)
950mV@10A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SK1015 产品概述

一、产品简介

SK1015 为江苏长电(CJ)出品的一款独立式肖特基整流二极管,封装为 SMCG。该器件面向中高电流整流和开关电源回路保护场合,具备低正向压降与快速开关特性,适用于对效率和开关损耗有要求的电源设计。

二、主要规格

  • 器件类型:肖特基二极管(单只独立式)
  • 型号:SK1015
  • 直流整流电流(IF):10 A(额定)
  • 正向压降(Vf):0.95 V @ IF=10 A
  • 直流反向耐压(VR):150 V
  • 反向漏电流(IR):100 μA @ VR=150 V
  • 非重复峰值浪涌电流(IFSM):250 A(冲击浪涌能力)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SMCG

三、性能亮点

  • 低正向压降:在10 A 电流下 Vf≈0.95 V,有助于降低整流损耗和结温升高,从而提高系统效率。
  • 高电压耐受:150 V 的反向耐压使其可用于较高输入电压或反向冲击场合。
  • 良好浪涌能力:IFSM=250 A,能承受启动或短时过流冲击,增强可靠性。
  • 宽温工作范围:-55 ℃ 至 150 ℃,适应工业级温度要求。
  • 适用于高速开关:肖特基结构固有的低反向恢复特性,可减少开关损耗和干扰。

四、典型应用

  • 开关电源(SMPS)整流和续流二极管
  • 逆变器与功率变换模块中的输出整流
  • 电池充放电回路、UPS 系统中的整流/保护
  • 电机驱动电路的保护与续流
  • 高频脉冲或脉动负载场合的整流解决方案

五、使用建议与注意事项

  • 热管理:在接近额定电流长时间工作时需采用合适的散热措施(散热片或良好 PCB 散热铺铜),并遵循器件的热阻及结-环境温度导则进行电流降额设计。
  • 反向漏流:反向漏电流随温度上升显著增加,设计时应考虑高温工况下的漏电影响。
  • 浪涌保护:尽管 IFSM 值较高,仍建议在预期有长时或重复浪涌情况下加入限流或保护电路。
  • 焊接与装配:按照通用表面贴装工艺(SMC/SMCG 类)进行焊接,避免超温烘烤及长时间回流,具体工艺参数参照厂家资料。

六、品牌与采购

品牌:CJ(江苏长电/长晶)。如需批量采购或获取更详尽的器件数据手册、封装尺寸及热阻参数,请联系供应商或厂商技术支持以获取原厂规格书和可靠性测试数据,以便进行最终设计验证与认证。

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