WMSIC Electronic Components

CJ SMF4764A

ModelSMF4764A
PackageSOD-123FL
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ SMF4764A
Type
CJ
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
SMF4764A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Zener Diode
Electronic Component
0.044g
Electronic Component
1
(Zzk)
3kΩ
(Zzt)
350Ω
Electronic Component
BM0264678865
Diode
1
Current(Ir)
100nA@76V
Power Dissipation(Pd)
1W
Electronic Component
95V~105V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF4764A — 100V 1W 稳压二极管(SOD-123FL)

一、产品概述

SMF4764A 是 CJ(江苏长电/长晶)推出的一款高压小功率稳压二极管,标称稳压值 100V,功耗等级 1W,采用 SOD-123FL 表面贴装封装。该器件适合在高电压偏置环境下做稳压、参考与过压保护等用途,具有低反向泄漏、较高结温范围与良好的动态阻抗特性,适合空间受限且需承受中等功率的高压应用。

主要参数概览:

  • 型号:SMF4764A
  • 稳压值(标称):100V(范围 95V ~ 105V)
  • 反向电流 Ir:100 nA @ 76V
  • 耗散功率 Pd:1W
  • 阻抗 Zzt:350 Ω
  • 阻抗 Zzk:3 kΩ
  • 工作结温:-55 ℃ ~ +150 ℃
  • 封装:SOD-123FL
  • 品牌:CJ(江苏长电/长晶)

二、主要特点

  • 高压稳压:标称 100V,适用于 100V 级别的稳压与参考需求。
  • 低泄漏电流:在 76V 时反向电流仅 100 nA,便于在高阻抗电路中保持稳定基线。
  • 良好动态阻抗:Zzt = 350 Ω(测试点附近)保证在工作点附近有较稳定的电压响应;Zzk = 3 kΩ 表示在击穿拐点附近的阻抗特性。
  • 便于贴装:SOD-123FL 表面贴装封装,适合自动化贴装工艺和紧凑 PCB 设计。
  • 宽温度范围:-55 ℃ ~ +150 ℃,适应工业级环境。

三、电气特性与工程计算(实用提示)

  • 最大允许运行电流(近似):Iz_max ≈ Pd / Vz = 1W / 100V = 10 mA(理论上限)。实际使用中应留裕量,建议在能保持期望稳压与温升可控的条件下选择工作电流远小于此值。
  • 分压电阻选择(简单公式):R = (Vin - Vz) / Iz,其中 Iz 为待选的稳压二极管工作电流。计算时要同时检查分压电阻上的功耗 Pr = (Vin - Vz) * Iz。
  • 选择工作点时应避免进入拐点区域(高 Zzk 区),以保证稳压性能和响应速度。

四、典型应用场景

  • 高压参考源:用于为 ADC、比较器或高压偏置电路提供稳压参考。
  • 过压保护/箝位:作为高压浪涌或尖峰电压的保护元件,限制电压上升。
  • 偏置与电平移位:在显示驱动、传感器偏置电路或放大器输入的电平管理中使用。
  • 测试设备与工业控制:在需要稳定高压的小型化模块中使用。

五、封装与装配注意

  • 封装为 SOD-123FL,适配自动贴装与回流焊工艺。贴装时注意极性标识与方向。
  • 由于 Pd 值较低(1W),散热依赖 PCB 铜箔面积与焊盘布局。建议在 PCB 中为二极管设计较大的焊盘并适当连通内层或底层铜,以提高散热能力并降低结温。
  • 回流焊温度与时长应遵循 CJ 或焊膏供应商的推荐曲线,避免过度热应力。

六、可靠性与热管理

  • 工作在高电压场合时,热耗主要由稳压电流与二极管电压决定。长期可靠性建议控制结温远低于最大结温 150 ℃。
  • 在环境温度较高或散热条件差的场合,需对工作电流进行降额(derating)。同时应检查焊盘布局及周围散热路径。
  • 在电磁兼容(EMC)或高频噪声环境下,稳压二极管可能产生或受噪声影响,必要时在电路中并联滤波电容或 RC 抑制网络。

七、选型建议与替代考虑

  • 若设计需要更低静态泄漏或更高功耗,请选择规格中泄漏更小或 Pd 更高的型号。
  • 对于更严格的稳压精度,注意选择 Zener 电流点并测试实际 Vz-I 曲线,因标称值在 ±5% 范围内。
  • 在遭受瞬态浪涌的场合,可并用瞬态抑制器(TVS)以分担能量,延长稳压二极管寿命。

如需数据手册中更详细的 V-I 曲线、热阻、典型测试条件或封装尺寸图,可参考 CJ 官方资料或提供具体应用条件以便进一步优化选型与电路设计。

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