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CJ MMBTA13
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MMBTA13
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MMBTA13
- Electronic Component
- 1
- Package
- SOT-23
- Type
- NPN
- Electronic Component
- Darlington Transistor
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0265599142
- Operating Temperature
- 55℃~+150℃
- Frequency(f T)
- 125MHz
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 300mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBTA13 NPN晶体管产品概述
一、产品基本信息
MMBTA13是江苏长电科技（CJ） 推出的高速NPN小信号晶体管，采用SOT-23超小型表面贴装封装，广泛应用于消费电子、通信、工业控制等领域的小信号放大与高速开关场景。
- 晶体管类型：NPN型
- 品牌：CJ（江苏长电/长晶）
- 封装：SOT-23（表面贴装）
- 丝印标识：2F
- 引脚定义：1脚（基极B）、2脚（发射极E）、3脚（集电极C）
二、核心电气参数（长电原厂规格）
以下为MMBTA13的关键电气参数，需严格遵循额定值以保证可靠性：
参数名称 数值（典型/最大） 测试条件 集电极-发射极击穿电压（VCEO） ≥45V IC=10mA，IB=0 集电极最大连续电流（IC） 100mA（Max） Ta=25℃ 发射极-基极击穿电压（VEBO） ≥6V IE=10mA，IC=0 直流电流增益（hFE） 100~400（典型） VCE=1V，IC=10mA 最大功耗（Pd） 200mW（Max） Ta=25℃ 工作温度范围（Tj） -55℃~150℃ 结温范围 开关特性（典型值） td=15ns，tr=10ns，ts=30ns，tf=10ns VCE=2V，IC=10mA，RL=1kΩ三、封装与引脚说明
3.1 SOT-23封装尺寸
SOT-23为超小型表面贴装封装，尺寸紧凑（单位：mm）：
- 长度：2.9±0.1
- 宽度：1.6±0.1
- 高度：1.1±0.1
- 引脚间距：0.95±0.05
3.2 引脚功能
从封装顶部（丝印面）观察，引脚顺序为左→右：1（B）、2（E）、3（C），实际焊接时需注意极性，避免反向接入损坏器件。
四、典型应用场景
MMBTA13因高速开关特性与小信号放大能力，适用于以下场景：
- 高速开关电路：逻辑门电平转换、LED驱动（小功率）、继电器控制（低电流）；
- 小信号放大：音频前置放大、传感器信号调理（如温度/压力传感器输出放大）；
- 射频辅助电路：低功率射频开关、中频放大（≤100MHz范围）；
- 电源管理：过流保护电路、电压基准辅助调节；
- 消费电子：手机/平板的按键控制、耳机音频放大、智能穿戴设备信号处理。
五、长电（CJ）品质特点
作为国内主流半导体厂商，长电MMBTA13具备以下优势：
- 高可靠性：符合GB/T 14036等行业标准，批量产品参数离散性≤5%；
- 环保合规：满足RoHS 2.0、REACH指令，无铅无卤；
- 耐温稳定性：SOT-23封装抗振动（10g/20~2000Hz），适合工业级环境；
- 成本优势：性价比高于进口同类器件，适合大规模量产。
六、使用注意事项
- 焊接防护：使用恒温烙铁（温度≤350℃），焊接时间≤3s，避免过热损坏结区；
- 额定值限制：严禁超过IC=100mA、VCEO=45V、Pd=200mW的最大额定参数；
- 静电防护：SOT-23封装对静电敏感（HBM≥2000V），需用防静电包装与工具操作；
- 存储条件：常温干燥环境（-20℃~40℃，湿度≤60%RH），开封后1个月内使用完毕。
MMBTA13凭借紧凑封装、高速特性与高可靠性，是小信号电路设计的常用选择，尤其适合长电生态下的量产项目。
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