WMSIC Electronic Components

CJ CJU50N06A

ModelCJU50N06A
PackageTO-252-2L
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJU50N06A
Type
CJ
Minimum package
2500

Technical parameters

Electronic Component
CJ
Electronic Component
CJU50N06A
Electronic Component
1
Package
TO-252-2L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.34g
Electronic Component
1
Electronic Component
BM0229991274
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
75W
Electronic Component
2500
Voltage(Vdss)
60V
Capacitor(Ciss)
3.4nF
Output Capacitor(Coss)
240pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJU50N06A 产品概述

一、产品简介

CJU50N06A 是 CJ(江苏长电/长晶)推出的一款 N 沟道功率 MOSFET,封装为 TO-252-2L(DPAK)。器件额定漏源电压为 60V,连续漏极电流可达 50A,适用于中低压高电流场合的开关与功率控制。

二、主要参数

  • 类型:N沟道 MOSFET
  • 漏-源电压 Vdss:60V
  • 连续漏极电流 Id:50A
  • 导通电阻 RDS(on):25mΩ @ Vgs=4.5V
  • 耗散功率 Pd:75W(视封装和散热条件而定)
  • 阈值电压 Vgs(th):2.5V @ 250µA
  • 总栅极电荷 Qg:56nC @ 10V
  • 输入电容 Ciss:3.4nF;输出电容 Coss:240pF;反向传输电容 Crss:220pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:TO-252-2L

三、关键性能与特点

  • 低导通电阻(25mΩ@4.5V),在 5V 驱动条件下具有良好导通性能,适合低压驱动系统。
  • 较高的额定电流(50A)与较大的耗散能力(75W),在良好散热下可满足较高功率需求。
  • 较大的栅极电荷(56nC@10V)表明开关时需较大驱动电流,快速切换时应选配低阻驱动器或在栅极串联阻抗做权衡。
  • Crss 为 220pF,需关注米勒效应对开关过渡的影响,尤其在高 dV/dt 场景下。

四、典型应用

  • DC-DC 转换器、同步整流
  • 直流电机驱动、开关电源(SMPS)
  • 负载开关、电池管理与逆变接口(中低压)
  • 汽车电子和工业控制(需考虑浪涌与瞬态抑制)

五、设计与使用建议

  • 驱动:推荐使用能够提供足够峰值电流的栅极驱动器以快速充放 Qg,若驱动能力有限可适当增加栅阻以防止振铃与过冲。
  • 开关损耗:考虑 Qg 与 Coss 带来的能量损耗,提升效率时可通过降低开关频率或优化驱动速度权衡。
  • 保护:对感性负载应配置 TVS、RC 吸收或斩波电路以抑制瞬态过压。
  • PCB 布局:尽量缩短栅极、漏极与源极走线,采用宽铜箔和多层散热过孔来增强散热,TO-252 底部焊盘应与大面积铜箔热垫相连。

六、封装与热管理

TO-252-2L(DPAK)适合表面贴装,需保证底部热焊盘与 PCB 大面积铜箔良好热接触。器件标称 Pd 在实际使用中受 PCB 散热面积与环境影响较大,推荐在高功率工况下使用散热基板或加大铜箔面积并辅以风冷。

七、可靠性与注意事项

  • 栅极对静电敏感,搬运与焊接过程中注意 ESD 防护。
  • 在高温或长时间高应力工作下,关注热循环与包封应力,按可靠性标准设计余量。
  • 规格参数以器件规格书为准,实际设计时请参考厂商提供的详细特性曲线与封装图纸。

八、总结

CJU50N06A 在 60V/50A 级别上提供了低 RDS(on) 与较高耗散能力,适合多种开关电源与功率控制场景。设计时应注意栅极驱动匹配、散热布局与瞬态保护,以发挥器件的性能与可靠性。

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