WMSIC Electronic Components

CJ BAS116

ModelBAS116
PackageSOT-23
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BAS116
Type
CJ
Minimum package
3000

Technical parameters

Electronic Component
CJ
Electronic Component
BAS116
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264678861
Current
200mA
Diode
Electronic Component
Current(Ir)
5nA@75V
(Vf)
1.25V@150mA
Power Dissipation(Pd)
225mW
Electronic Component
3000
Voltage Rating(Vr)
75V
(Trr)
3us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAS116 产品概述

一、产品简介

BAS116 是一款独立式小信号开关二极管,由 CJ(江苏长电/长晶)提供,封装为 SOT-23。该器件专为快速开关与小电流整流场景设计,体积小、泄漏低、响应快,适合便携设备和高密度电路板中的信号整流与保护用途。

二、主要特性

  • 直流反向耐压(Vr):75V
  • 正向压降(Vf):约 1.25V(在 150mA 条件下)
  • 整流电流(Io):200mA(连续)
  • 非重复峰值浪涌电流(Ifsm):2A
  • 反向电流(Ir):5nA(在 75V)
  • 反向恢复时间(Trr):约 3µs
  • 耗散功率(Pd):225mW
  • 封装:SOT-23,单个独立管脚设计

三、电气与性能说明

BAS116 在中等电流工作点(百毫安级)下具有较低的反向泄漏和可接受的正向压降,反向恢复时间约 3µs,适合中频率的开关应用。225mW 的功耗限制提示其在高平均功率场合需要良好散热或并联/更大封装替代。

四、典型应用场景

  • 开关电源小信号整流与钳位
  • 信号切换与隔离电路
  • 反向保护、浪涌钳制与电平移位
  • 便携设备、消费电子、通信终端中的低功耗整流

五、封装与热管理

SOT-23 体积小,适合表面贴装。在 PCB 设计时建议:

  • 增加焊盘与周围铜箔面积以改善散热;
  • 将发热器件与敏感元件隔离,并避免长期高功耗工作;
  • 按制造商推荐的焊盘尺寸和回流曲线进行装配,避免过热。

六、使用注意事项与典型电路

  • 在高反向电压或高频切换场合,关注反向恢复导致的尖峰电压与电磁干扰,必要时并联缓冲或 RC 吸收网络;
  • 若需承受瞬态浪涌,应评估 Ifsm 与实际浪涌能量,必要时增加限流或选用更高浪涌规格的器件;
  • 在串联整流或开关钳位电路中,请保证正向压降与功耗预算匹配。

七、采购与替代建议

BAS116 适用于对体积、泄漏与切换速度有中等要求的应用。若需更高频率或更低正向压降,可考虑低 Vf 或肖特基二极管;若需更高功率处理能力,可选更大封装或功率型整流二极管。选型时应以正向压降、反向耐压、泄漏电流与恢复时间为主要比较指标,并参照完整数据手册确认封装及温度特性。

如需进一步的电路示例、PCB 封装建议或可靠性数据,请提供具体应用场景与工作条件,我可基于该条件给出更精确的设计建议。

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