WMSIC Electronic Components

CJ S10M

ModelS10M
PackageSMCG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ S10M
Type
CJ
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
S10M
Electronic Component
1
Package
SMCG
Electronic Component
General Purpose Diode
Electronic Component
0.292g
Electronic Component
1
Electronic Component
BM0230137753
Current
10A
Diode
1
Current(Ir)
10uA@1000V
(Vf)
1V@10A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S10M 产品概述

一、产品简介

S10M 是由 CJ(江苏长电/长晶)生产的通用整流二极管,采用 SMCG 封装,面向中高电压整流与续流应用。该器件在 10A 工作电流下正向压降约 1.0V,反向耐压可达 1000V,兼顾低导通损耗与高耐压能力,适用于工业电源、逆变器、充电机与整流桥等场合。

二、主要电气参数

  • 正向压降 Vf:1.0V @ If = 10A
  • 直流反向耐压 Vr(RRM):1000V
  • 额定整流电流 If(AV):10A
  • 反向漏电流 Ir:≤10µA @ Vr = 1000V
  • 非重复峰值浪涌电流 Ifsm:240A(单次冲击条件)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SMCG
  • 品牌:CJ(江苏长电/长晶)

三、产品特性与优势

  • 低正向压降:在 10A 工作电流下 Vf≈1V,降低导通损耗,有利于提升效率并减少发热。
  • 高耐压等级:1000V 反向耐压可满足高压整流与多级电源需求。
  • 漏电流小:1000V 条件下 Ir ≤10µA,有利于降低待机功耗与高压侧泄漏风险。
  • 抗浪涌能力强:240A 峰值浪涌电流能应对启动与短时过载冲击。
  • 宽温度工作范围:适应工业级环境与冷启动条件。

四、典型应用场景

  • 开关电源(中压整流、桥式整流)
  • 工业不间断电源(UPS)、逆变器
  • 变频器与电机驱动的续流回路
  • 电池充电器与电源模块
  • 通用电源整流与保护电路

五、装配与散热建议

  • SMCG 为小型功率封装,平时需在电路板上做好铜箔散热设计;若长期 10A 运行,应考虑散热铜箔加厚、散热片或导热垫配合使用。
  • 焊接工艺应遵循厂商推荐的回流曲线与温度限值,避免过热损伤器件或引起应力裂纹。
  • PCB 布局上尽量缩短电流回路路径并增大焊盘面积以减小电阻与热阻。

六、可靠性与使用注意

  • 避免长期在极限额定值下连续工作,建议在设计时对反向电压和结温做适当裕量。
  • 非重复峰值浪涌虽高,但重复或高频冲击会缩短寿命,应进行浪涌能量限流或采用保护电路。
  • 安装时注意极性标识,确保正确接线以防反向击穿。
  • 存储与操作环境应防潮、防静电,避免机械应力作用到封装引脚。

如需 S10M 的完整数据手册(Electrical characteristics、thermal resistance、recommended land pattern、reflow profile 等)或样品测试报告,可提供进一步支持以便完成产品选型和可靠性评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.