Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ SMF12CA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ SMF12CA
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- SMF12CA
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0226369903
- Voltage
- 19.9V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 13.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMF12CA 瞬态抑制二极管产品概述
一、产品简介
SMF12CA 是江苏长电（CJ/长晶）提供的一款双向瞬态电压抑制器（TVS），采用 SOD-123 封装，专为 12V 工况下的瞬态浪涌保护而设计。器件响应速度快、漏电流低、能承受较高脉冲能量，适合对抗电源浪涌、开关瞬变和电磁兼容（EMC）干扰。
二、主要电气参数
- 型号：SMF12CA（TVS，双向）
- 反向截止电压 Vrwm：12 V（反向工作电压，系统推荐最大静态电压）
- 击穿电压（Vbr）：13.3 V（器件进入雪崩导通的典型值）
- 钳位电压 Vc（Ipp = 10 A）：19.9 V（在峰值脉冲电流下的最大夹断电压）
- 峰值脉冲功率 Ppp：200 W（瞬态脉冲能量能力，按厂方测试条件）
- 峰值脉冲电流 Ipp：10 A（对应钳位电压时的脉冲电流）
- 反向电流 Ir：1 μA（在 Vrwm 下的典型泄漏电流）
- 极性：双向（对称保护正负极瞬变）
- 封装：SOD-123（小体积、适合自动贴装）
注：脉冲功率/钳位电压随测试波形（如 8/20µs、10/1000µs 等）和环境温度有所变化，选型时请参考厂家详细数据手册。
三、封装与热特性
SOD-123 小体积封装有利于在空间受限的板级防护设计中应用。由于 TVS 在吸收脉冲能量时会产生热量，建议在布局时为封装周边留足铜箔面积以增强散热能力；对高能量或频繁浪涌场景，应考虑并联或选用更大功率的封装。
四、典型应用场景
- 汽车电子（12V 总线的瞬态浪涌保护）
- 通信和网络设备的接口保护（防雷和突发浪涌）
- 工业控制、电源模块、测控仪表的板级过电压保护
- 车载摄像头、传感器等对双向浪涌抑制的场合
五、工程使用建议
- 放置位置：将 TVS 安装在受保护端口或接近连接器处，尽量缩短到可能受干扰源的走线长度。
- 布线与地：保护器到地（或到参考回路）的回路应尽可能短且阻抗低；在高能场景下使用较宽的铜箔或加固地平面。
- 热与频率限制：Ppp 为瞬态脉冲能量指标，勿用于连续功率耗散；若环境温度较高或脉冲重复率高，应考虑温度降额或更高额定器件。
- 极性注意：SMF12CA 为双向器件，适合交流或正负对称瞬态；若仅需单向保护，可选择对应单向型号以获得更低钳位电压。
- 验证测试：在最终产品中进行实际浪涌/ESD 测试以确认布局与器件组合满足系统需求。
六、可靠性与选型要点
SMF12CA 以低漏电（约 1 μA）、较低的击穿门槛和约 19.9V 的钳位能力，适配 12V 车载和民用电源保护。选型时应综合考虑系统允许的最大钳位电压、脉冲能量、重复浪涌频率和封装散热能力；如需更高能量吸收或更低钳位电压，可比较同系列不同功率或单向型号。
如需用于关键应用（汽车三级认证、严苛工业环境等），建议索取厂家数据手册与可靠性报告，并在目标系统上做完整验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
