WMSIC Electronic Components

CJ CJ74HC08BDN

ModelCJ74HC08BDN
PackageTSSOP-14
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJ74HC08BDN
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CJ74HC08BDN
Electronic Component
1
Package
TSSOP-14
Electronic Component
Logic Gate
Electronic Component
74HC
Electronic Component
0.24g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0264398927
Operating Temperature
40℃~+125℃
Operating Voltage
2V~6V
Logic Type
and Gate
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJ74HC08BDN 产品概述

一、概述

CJ74HC08BDN 是江苏长电(CJ/长晶)提供的一款高速 CMOS 逻辑门芯片,集成四路独立的二输入与门(4 × 2‑输入 AND)。器件采用 TSSOP-14 封装,工作电源范围宽(2.0 V ~ 6.0 V),适用于多种电源轨及低功耗系统。器件设计支持过压容忍输入(over‑voltage tolerant input),在实际电路中能简化输入保护电路的设计。

二、主要电气参数

  • 逻辑类型:四路二输入与门(4 × 2‑input AND)。
  • 工作电压:2.0 V ~ 6.0 V。
  • 静态电流(Iq):典型 2 μA(低静态功耗)。
  • 输出驱动能力:IOL = 5.2 mA,IOH = 5.2 mA(适合一般逻辑负载驱动)。
  • 输入电平阈值(VIH / VIL):提供了多组测试条件下的参考值(例如 1.5 V、4.2 V、3.15 V 的 VIH;1.35 V、0.5 V、1.8 V 的 VIL),请根据具体工作电源与数据手册中对应条件确认。
  • 输出电平(VOH / VOL):在不同 VCC/负载条件下有相应参考值(如 VOH 可达 4.4 V、5.9 V、1.9 V;VOL 典型 260 mV),最终性能请以器件规范表为准。
  • 工作温度范围:-40 ℃ ~ +125 ℃。
  • 输入通道数:每门 2 个输入,共 4 门。
  • 功能特性:过压容忍输入(减小对外部限流保护的依赖)。

三、功能特点与优势

  • 低功耗:静态电流极小,适合电池供电与便携设备。
  • 宽电源范围:2 V~6 V 支持多种系统电源等级,便于设计移植与兼容。
  • 过压容忍输入:在一定范围内允许输入电压超过 VCC,有利于混合电平接口设计(但仍应遵循数据手册的限制)。
  • 四路集成:节省 PCB 空间,适合中等规模的逻辑处理。
  • TSSOP-14 封装:适合要求较小占板面积的应用,便于表面贴装生产。

四、典型应用

  • 数字逻辑电路的基本组合逻辑单元。
  • MCU/FPGA 前端门阵列与信号合成。
  • 工业控制、家用电器及消费电子中对逻辑判定、使能控制等功能的实现。
  • 需要过压容忍输入的混合电平接口场合(仍建议参照数据表限定)。

五、使用建议与注意事项

  • 电源去耦:在 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容,抑制瞬态噪声。
  • 负载能力:器件输出驱动能力有限(典型 5.2 mA),如需驱动更大电流或感性负载,应增加缓冲器或驱动器。
  • 输入电压限制:尽管具备过压容忍输入,仍需避免长期将输入电压拉至远高于 VCC 或低于 GND 的情况,以免产生不可预测的内部电流和损伤。
  • 温度与散热:TSSOP-14 封装热阻较小,正常工作环境下无需额外散热,但在高温或高频切换条件下应注意 PCB 导热与布局。
  • ESD 与上电顺序:遵循常规静电防护与上电顺序要求,避免在无防护的情况下接入高电平。

六、封装与采购信息

  • 品牌:CJ(江苏长电 / 长晶)。
  • 型号:CJ74HC08BDN。
  • 封装:TSSOP-14(表面贴装)。
  • 温度等级:工业级(-40 ℃ ~ +125 ℃)。
  • 采购时建议索取最新数据手册,确认在所需 VCC、温度与负载条件下的电气参数曲线与最大允许值,以确保设计的稳健性。

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