Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ 1SMA4744A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 1SMA4744A
- Type
- CJ
- Minimum package
- 5000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 1SMA4744A
- Electronic Component
- 1
- Package
- SMAG
- Electronic Component
- Zener Diode
- Electronic Component
- ±5%
- Electronic Component
- 0.11g
- Electronic Component
- 1
- (Zzk)
- 700Ω
- (Zzt)
- 14Ω
- Electronic Component
- BM0229991211
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA4744A（CJ）产品概述
一、主要性能
1SMA4744A 为 CJ（江苏长电/长晶）出品的稳压二极管，标称稳压值 15V，最大耗散功率 Pd = 1W；反向漏电流 Ir = 100nA（在 11.4V 条件下测得）；稳态阻抗 Zzt = 14Ω，击穿拐点阻抗 Zzk = 700Ω；工作结温范围 -55℃ ~ +150℃。封装为 SMAG，适用于表面贴装工艺。
二、器件特点
- 标称电压 15V，适合中低功率稳压场合作为基准或保护元件。
- 低反向漏电（100nA 级），在高阻抗电路中可作为可靠的电压参照。
- 相对较低的稳态阻抗（14Ω）意味着在额定工作点附近具有较好的稳压性能；高 Zzk 值表明在极小电流时有明显的击穿转折特性。
- 宽工作结温范围，适应工业级温度环境。
- SMAG 封装利于自动贴装和批量生产。
三、典型应用
- 基准电压源与低功耗稳压电路（作为并联式稳压元件）。
- 浪涌与过压保护（偏置在待保护节点上，吸收瞬态能量）。
- 仪器仪表与传感器前端的简单阈值检出与参考电压。
- 小型开关电源辅助参考与钳位电路。
四、使用与设计注意事项
- 最大稳压电流近似 Iz_max = Pd / Vz = 1W / 15V ≈ 66.7mA；设计中应确保实际工作电流低于该值并留余量。
- 实际稳压电流由串联限流电阻决定：R = (Vin - 15V) / Iz。选择时应考虑输入电压变化和最坏工况下的最大电流。
- 由于 Zzt 和 Zzk 的存在，在极低电流（接近击穿拐点）和高纹波工况下输出电压会有较大偏差，应在需要高精度时增加滤波/放大电路或采用基准源。
- 封装散热受 PCB 铜箔面积影响显著，布局时尽量增大焊盘和散热铜层。
五、热管理与可靠性
- 器件在靠近 Pd 限值工作时结温上升显著，建议在高环境温度或连续高功率工况下进行降额设计。
- PCB 上应提供足够的散热面积與过孔连接内层铜箔，以降低结-环境热阻。
- 长期可靠性与温度循环、湿热等可靠性试验相关，工业应用请按系统等级进行额外验证。
六、封装与采购信息
- 品牌：CJ（江苏长电/长晶）
- 型号：1SMA4744A
- 封装：SMAG（表面贴装）
- 选型时请参考供应商完整数据手册获取详细的电气特性曲线、测试条件与封装尺寸图以确保与系统匹配。
如需我根据您的输入电压、负载和工作环境帮您计算限流电阻和预计稳压精度，请提供 Vin、预计纹波与允许误差范围。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
