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CJ BAS19
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BAS19
- Type
- CJ
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BAS19
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0228678251
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@100V
- (Vf)
- 1.25V@200mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS19 开关二极管（CJ/长晶）产品概述
一、产品简介
BAS19 为独立式小信号开关二极管，CJ（江苏长电/长晶）出品，SOT-23 封装。器件面向高速开关与小功率整流应用，具有较低正向压降与很小的反向漏流，适合在高压、开关频率较高的场合替代传统整流二极管。
二、主要特性
- 独立式小信号开关二极管，SOT-23 封装，便于表面贴装（SMT）生产。
- 正向压降 Vf = 1.25 V（在 If = 200 mA 时）。
- 直流反向耐压 Vr = 120 V，适合较高电压栈或隔离侧应用。
- 工作整流电流 If = 200 mA，非重复峰值浪涌电流 Ifsm = 2.5 A（脉冲）。
- 反向电流 Ir = 100 nA（在 Vr = 100 V 时），漏电小，有利于高阻输入或保持电路。
- 反向恢复时间 Trr ≈ 50 ns，具备高速开关特性。
- 最大功耗 Pd = 250 mW（需按封装与散热条件降额使用）。
三、电气参数要点
- 由于 Pd 仅 250 mW，器件在 SOT-23 小封装中散热能力有限，连续 200 mA 工作时需注意环境温度和 PCB 散热。
- 1.25 V 的正向压降在 200 mA 水平仍偏高于经典小信号二极管（如 1N4148），因此在对压降敏感的低压电源路径需评估功耗。
- 50 ns 的反向恢复时间适用于几十到数百千赫兹的开关频率场景，对高频开关损耗有明显优势。
四、典型应用
- 高频整流与检波电路（例如通信前端检波）。
- 开关电源中的快速切换、夹位或反向保护。
- 信号开关、逻辑电平隔离与电平移位。
- 低漏电要求的保持/采样电路及小电流保护措施。
五、使用建议与热管理
- 推荐在 PCB 上为 SOT-23 器件提供短路径与较大铜箔散热面积，必要时在底层增加散热铜或过孔。
- 对于间歇性浪涌（Ifsm 2.5 A）建议配合限流元件或合理的脉冲宽度控制，避免超出器件热应力能力。
- 工作环境温度与结温须按数据手册进行降额设计，长时间 200 mA 工作时应评估结温上升对可靠性的影响。
- 焊接时遵循回流温度曲线，避免长时间高温暴露导致封装或内部结构老化。注意防静电保护（ESD）。
六、封装与采购提示
- SOT-23 小外形，适合自动化贴装与高密度板设计。通常以卷盘（Tape & Reel）方式供货。
- 选型时请参考生产批次的完整数据手册，核实最大额定值与温度特性，若需替代件请对比 Vr、Vf、If、Trr 与封装兼容性。
以上为基于给定参数的 BAS19（CJ）产品概述，供电路设计与元器件选型参考。若需完整电气参数曲线、温度特性或封装尺寸图，请提供要求，我可进一步整理具体数据和应用电路示意。
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