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CJ S2M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ S2M
- Type
- CJ
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- S2M
- Electronic Component
- 1
- Package
- SMAG
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Electronic Component
- BM0235662479
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.1V@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S2M 通用整流二极管（独立式 / SMAG 封装）产品概述
一、产品简介
S2M 为 CJ（江苏长电/长晶）出品的通用独立式整流二极管，额定直流整流电流 2A、反向耐压高达 1kV。器件正向压降在 2A 时约为 1.1V，具有良好的整流效率与耐冲击能力，适用于高压直流整流与一般功率电子电路的整流保护场合。
二、主要参数与特性
- 正向压降 Vf：1.1V @ 2A，稳态 conduction 损耗可预估。
- 直流反向耐压 Vr：1000V，适合高压整流应用。
- 直流整流电流 If：2A（连续）。
- 反向电流 Ir：5μA @ 1kV，待机与漏电损耗低。
- 非重复峰值浪涌电流 Ifsm：50A（单次脉冲能力强）。
- 工作结温范围：-55℃ ~ +150℃；封装：SMAG（独立塑封）。
三、典型应用场景
适用于开关电源高压整流、充电器与适配器电源回路、高压电源与倍压电路、工业设备高压整流、保护回路及需要中等电流高耐压的消费类与工业电子产品。
四、封装与热管理建议
SMAG 独立封装便于手工焊接与波峰/回流焊工艺。典型工作点 2A 时器件热耗约 P ≈ Vf×I ≈ 1.1V×2A = 2.2W，连续运行时需合理的 PCB 散热设计：增大焊盘铜厚与面积、使用热穿孔导热至内层/底层铜箔，必要时并联散热元件或采用强制风冷。Ifsm 为脉冲规格，勿将其当作长期频繁冲击条件下的许可值。
五、选型与使用建议
- 连续工作尽量留有余量，必要时在设计中按 70%~80% 额定电流考虑热稳定性。
- 对于含反向高压的应用，注意 PCB 间距与爬电距离。
- 在高冲击或重复浪涌场合，应配合限流元件或浪涌抑制器使用，避免长期依赖 Ifsm。
- 关注焊接工艺曲线，避免过热致使封装或内芯受损。
六、质量与供应
CJ（长电）在国内封装与分立器件领域具备成熟产能与良好品质控制。选购时请参考最新器件 Datasheet 与批次检验报告，确认包装、出货与可靠性测试满足项目要求。若需样品或长期供货，可联系厂家代理或授权分销商。
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