WMSIC Electronic Components

CJ US1G

ModelUS1G
PackageSMAG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ US1G
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
US1G
Electronic Component
1
Package
SMAG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0257713196
Current
1A
Diode
1
Current(Ir)
5uA@400V
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US1G(SMAG)高效率二极管 — 产品概述

一、产品简介

US1G 是江苏长电(CJ/长晶)推出的一款通用高效率整流二极管,采用 SMAG 表面贴装封装。器件针对中高压整流与开关电源回路进行了优化,兼顾耐压、低正向压降与较快的恢复特性,适用于小功率开关电源、适配器、充电器及一般整流场合。

主要参数一览:

  • 二极管配置:1 个独立式
  • 正向压降 (Vf):1.3 V @ 1 A
  • 直流反向耐压 (Vr):400 V
  • 整流电流:1 A
  • 反向电流 (Ir):5 μA @ 400 V
  • 反向恢复时间 (Trr):50 ns
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 非重复峰值浪涌电流 (Ifsm):30 A
  • 封装:SMAG
  • 品牌:CJ(江苏长电/长晶)

二、主要特点与优势

  • 耐压能力高:400 V 反向耐压能满足较高电网及开关电压场景的整流要求。
  • 低正向压降:1.3 V @ 1 A 在同类高压整流器件中属于较低水平,有助于降低导通损耗,提高效率。
  • 低反向泄漏:在满耐压下 Ir 仅 5 μA,有利于减少空载及待机能耗。
  • 快速恢复:50 ns 的反向恢复时间适合中频率开关电源,能有效抑制开关尖峰与振铃。
  • 良好的浪涌承受能力:30 A 的单次浪涌能力满足启动与短时冲击电流需求。
  • 宽工作结温:-55~+150 ℃,适应较宽温度环境并利于高温工作点选择。

三、典型应用场景

  • 开关电源整流与输出回路(SMPS 输出整流、同步替代)
  • 适配器、充电器、LED 驱动器的续流/整流二极管
  • 输入桥式整流(对电压和频率有一定要求的场合)
  • 极性保护、反向防护与一般直流整流用途

四、选型与使用建议

  • 温度与散热:尽管器件允许高达 150 ℃ 结温,但为可靠性建议在设计中留有裕量,优先通过 PCB 铜箔与散热面减小结温,必要时采用热沉或加强散热设计。
  • 电流裕量:额定整流电流 1 A,连续工作时考虑环境温度和 PCB 散热条件进行降额,避免长时间在额定电流上工作导致寿命下降。
  • 开关频率影响:50 ns 的反向恢复时间适用于常见的中低频开关电源,若工作频率极高或对开关损耗极为敏感,可考虑超快恢复或肖特基器件。
  • 浪涌能力:Ifsm 30 A 可应对短时冲击,但频繁冲击会损害器件,需在系统层面控制启动和短路条件。
  • 焊接与封装兼容性:SMAG 表面贴装,建议按照厂商推荐的回流焊曲线与 PCB 足迹进行制造,以保证焊接可靠性。

五、可靠性与质量注意事项

  • 储存与湿敏:遵循器件的储存与防潮措施,焊接前若超过厂商规定的封装暴露时间应进行烘烤处理。
  • 测试与验证:在关键电源或高可靠性场合,建议在目标工作温度与负载条件下做长期老化与热循环验证。

总结:US1G(SMAG)以其 400 V 耐压、较低正向压降、低漏电与 50 ns 的反向恢复时间,适合多种中小功率整流与开关应用。合理的散热和降额设计可有效延长器件使用寿命并提升系统整体效率。若需进一步的封装尺寸、典型曲线或回流焊建议,可参考厂家数据手册或索取样片验证。

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