WMSIC Electronic Components

CJ BC847T

ModelBC847T
PackageSOT-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BC847T
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BC847T
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0227365940
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC847T 1E (SOT-523) 产品概述

一、概述

BC847T 1E 是 CJ(江苏长电/长晶)生产的一款小型 NPN 晶体管,采用超小封装 SOT-523,面向通用小信号放大与开关场合。器件在低电流区具有良好的直流电流增益 (hFE≈110 @ Ic=2mA, Vce=5V),工作温度范围宽(-55℃ ~ +150℃),适合空间受限和对温度稳定性有要求的应用。

二、主要参数与特性

  • 晶体管类型:NPN
  • 直流电流增益 hFE:110 @ Ic=2mA, Vce=5V
  • 最大集电极电流 Ic:100mA(注意Pd与热限制)
  • 集电极-发射极击穿电压 Vceo:45V
  • 发射极-基极击穿电压 Vebo:6V
  • 集电极截止电流 Icbo:15nA(典型弱漏电表现)
  • 集电极-发射极饱和电压 VCE(sat):约700mV(在指定偏流下)
  • 特征频率 fT:≈100MHz,适合中频小信号放大
  • 功耗 Pd:150mW(在良好散热条件下使用)
  • 封装:SOT-523(超小型表贴)

三、应用场景

  • 小信号放大器:音频前级、传感器信号放大等低功耗场合。
  • 通用开关:驱动小负载或作为逻辑电平的开关元件(注意饱和电压)。
  • 高频放大与缓冲:fT≈100MHz,适合中等频段信号处理。
  • 移动与便携设备:由于封装体积小、适合高密度 PCB 布局。

四、封装与热管理

SOT-523 封装体积极小,适合高密度布线,但散热能力受限。器件最大耗散功率仅 150mW(无散热板时),在实际设计中需考虑:

  • 限制集电极电流与电压,避免接近最大功耗。
  • PCB 走铜和焊盘面积对散热影响显著,可在芯片附近增加铜箔或热通孔以改善散热。
  • 在高环境温度或连续功率工作时,应评估结温,避免超过 +150℃。

五、使用建议与注意事项

  • 在设计偏置时,以 Ic 在安全范围内(如数 mA 至数十 mA)获得稳定 hFE。
  • 对于开关应用,考虑 VCE(sat)≈700mV 在饱和时的压降,必要时并用驱动级以降低功耗。
  • 芯片极小,贴装与返修需使用细尖 nozzle 和精确回流焊工艺,避免过热和机械应力。
  • 引脚排列与焊盘定义请以厂家完整数据手册为准,封装极小且引脚方向敏感。
  • ESD 防护:器件敏感,建议在生产与测试过程中采取静电防护措施。

六、订购与质量

BC847T 1E 由 CJ(江苏长电/长晶)提供,SOT-523 小封装便于批量贴装。购买时注意料号、包装形式(卷盘等)与批次一致性,并参考厂家数据手册和可靠性试验报告,确保符合目标应用的温度与寿命要求。

总结:BC847T 1E 在体积极小的封装下提供了良好的低电流增益、适中的频率响应与较高的击穿电压,适合便携、空间受限的通用小信号放大与开关应用。使用时需重点关注功耗限值与 PCB 散热设计。

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