WMSIC Electronic Components

CJ BZT52C9V1

ModelBZT52C9V1
PackageSOD-123
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZT52C9V1
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZT52C9V1
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
(Zzk)
100Ω
(Zzt)
15Ω
Electronic Component
BM0226465874
Diode
1
Current(Ir)
500nA
Power Dissipation(Pd)
500mW
Electronic Component
8.5V~9.6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C9V1 产品概述

一、产品简介

BZT52C9V1 为独立式稳压二极管(Zener),由 CJ(江苏长电/长晶)供货,采用 SOD-123 小型贴片封装。器件标称稳压值 9.1V,适用于低功耗、面积受限的基准和稳压场合,可作为简单的并联稳压、过压限幅与偏置基准元件。

二、主要电气与热参数

  • 标称稳压:9.1V(典型)
  • 稳压范围:8.5V ~ 9.6V
  • 反向漏电流 Ir:500nA(在 6V 条件下)
  • 阻抗:Zzk = 100Ω,Zzt = 15Ω(器件不同时工作点下的阻抗指标)
  • 耗散功率 Pd:500mW(最大)
  • 工作结温范围:-55℃ ~ +150℃

三、典型应用场景

  • 作为低成本并联稳压器(小电流负载)
  • 基准电压、偏置电路(放大器偏置、逻辑电平偏置)
  • 过压限幅、脉冲钳位(低能量瞬态)
  • 便携式与电池供电设备中的局部参考

四、设计与使用建议

  • 功率与电流:理论最大稳压电流约为 Pd/Vz ≈ 500mW / 9.1V ≈ 54.9mA,实际应做热与可靠性余量,长期工作建议远低于此值(典型推荐工作电流为几 mA 至十几 mA 级)。
  • 串联限流电阻:并联稳压时通过 Rs 限定电流,计算时需考虑最大输入电压与器件耗散上限。
  • 噪声与纹波抑制:稳压二极管本身对噪声与纹波抑制能力有限,若需较低纹波应在输出并联电容或采用专用线性稳压芯片。
  • 温度与热设计:SOD-123 封装散热能力有限,PCB 铜箔、焊盘尺寸及周围散热路径会显著影响结温,建议在靠近元件区域布置适当散热铜箔并遵循厂商推荐的焊盘设计。
  • 浪涌保护:BZT52C9V1 适合低能量脉冲,但不等同于高能量 TVS,若需吸收较大浪涌能量应选择专用 TVS 器件。

五、封装与焊接

SOD-123 封装适合自动贴装与回流焊工艺。具体的回流温度曲线、焊盘尺寸和保存条件应参照 CJ 官方数据手册以保证焊接可靠性与元件性能。

六、测试与替代

  • 测试时按数据手册规定的测试电流测量稳压值,注意在低电流区(kΩ 阶段)稳压点会偏移并伴随较大阻抗。
  • 若需更高功率或更低阻抗,可考虑更大封装或功率型稳压二极管;需更精准参考源时考虑低漂移参考芯片。

总结:BZT52C9V1 是一款适用于小体积、低功耗稳压与限幅应用的 9.1V SOD-123 稳压二极管。设计时应重视功率耗散与热管理,并根据实际应用选择合适的工作电流与外围限流、滤波元件。有关更详细的参数、测试条件与封装尺寸,请参考厂家数据手册。

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