WMSIC Electronic Components

CJ DTC113ZCA

ModelDTC113ZCA
PackageSOT-23
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ DTC113ZCA
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
DTC113ZCA
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM69418583
Operating Temperature
55℃~+150℃
Resistor
10
Resistor
1kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:数字晶体管 DTC113ZCA E21 SOT-23

1. 简介

DTC113ZCA 是一款高性能数字晶体管,由江苏长电(CJ)公司制造,采用 SOT-23 封装形式。这种晶体管专为低功耗应用设计,具备快速开关特性,常用于中小功率电路的开关和放大功能,广泛应用于消费电子、通讯设备以及计算机外围设备等领域。

2. 封装和外形

DTC113ZCA 采用 SOT-23 封装,是一种小型、轻量化的表面贴装元件。SOT-23 封装的尺寸通常为 3.0 mm × 2.9 mm × 1.1 mm,适合高密度电路板的应用。通过SOT-23 封装设计,不仅可以节省电路板面积,还能有效减少焊接故障和成本问题。

3. 电气参数和特性

DTC113ZCA 的主要电气特性包括:

  • 集电极-发射极电压(Vce): 最大可耐受电压为 50V,适合中等电压应用环境。
  • 发射极-基极电压(Veb): 最大额定值为 5V,确保在不同操作条件下的稳定性。
  • 集电极电流(Ic): 最大输出电流可达 300mA,支持多种信号驱动能力。
  • 开关时间: DTC113ZCA 的开关速度快,可以在毫秒甚至微秒级别内完成开关,满足快速信号处理的需求。
  • 功耗: 该晶体管在正常工作条件下表现出优良的低功耗特性,有助于延长便携式设备的电池寿命。

4. 应用场景

DTC113ZCA 可广泛应用于多个领域:

  • 消费电子产品: 例如电视、音响、计算机周边设备中,作为开关元件以控制电源和信号的传输。
  • 通讯设备: 在各种通讯协议中,用于信号的放大和开关。
  • 电源管理: 适用于电池供电系统中,以控制充电、放电过程的开关。
  • RC 网络和时钟生成器: 在产生时钟信号或充放电电路中,有效调节频率。
  • 汽车电子: 在新能源汽车中,适合用于各种电子控制单元(ECU)以及灯光控制系统。

5. 竞品对比

与市场上其他数字晶体管型号相比,DTC113ZCA 在电压、功率输出以及开关速度上均表现出色。其集成电路设计过载能力强,适用于严苛的环境和条件,且由于其低功耗设计,能有效降低散热问题。此外,长电品牌在电子元件工业中的信誉和稳定性,使其成为可靠的选择。

6. 使用注意事项

在使用 DTC113ZCA 时,用户应注意以下几点:

  • 工作环境: 确保在指定的温度和湿度条件下操作,避免因环境影响导致元器件失效。
  • 焊接要求: 由于其小型封装,焊接过程中需注意温度变化,以避免对元件造成热损伤。
  • 动态性能: 在高频率应用中,应严格设计电路,以防止过度振荡和信号失真。

7. 结论

DTC113ZCA 作为一款高效、可靠的数字晶体管,以其卓越的性能和灵活的应用特性,已成为多种电子设备设计中的重要元件。无论是在消费电子还是工业应用中,DTC113ZCA 都表现出色,极大推动了电子产品的技术进步。随着电子技术的发展,该型号的数字晶体管在未来或许还会有更广泛的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.