Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ SS8050 SOT-323 SS8050
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- CJ SS8050 SOT-323
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- SS8050 SOT-323
- Electronic Component
- 1
- Package
- SOT-323
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0257639486
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS8050 SOT-323 产品概述
一、产品基本信息
SS8050是一款高性能的NPN型三极管，采用SOT-323封装，广泛应用于电子电路中的信号放大和开关场合。该器件由中国长电集团（CJ）生产，具有良好的性能特点，适合各种低功耗电子设备的应用。
- 型号: SS8050
- 类型: NPN三极管
- 封装: SOT-323
- 最大集电极-射极电压（Vceo）: 25V
- 最大集电极电流（Ic）: 1.5A
- 直流电流增益（HFE）: 200-350
二、封装特性
SS8050采用的SOT-323封装是表面贴装（SMD）型封装，体积小巧，便于在空间有限的电路板上进行集成。该封装在尺寸上通常为2.0mm × 1.6mm × 1.0mm，适合高密度布局，广泛应用于移动设备、家用电器及各种便携式电子产品中。
三、电气特性
最大集电极电压 (Vceo): SS8050的最大集电极-射极电压为25V，使其在中低电压应用中具有良好的适用性。适当的电压范围确保了三极管在工作过程中不会受到过电压的影响，从而提高了电路的稳定性和可靠性。
最大集电极电流 (Ic): SS8050能够承受最高1.5A的集电极电流，适合于驱动小型负载或输出信号到较大的负载。这使得SS8050在功率放大和开关应用中展现出优异的表现，特别是在低功耗但需要高电流驱动的场合。
直流电流增益 (HFE): 电流增益范围为200-350，表明其具备良好的信号放大能力。在实际应用中，可以根据需要选择适当的工作电流和偏置条件，以达到最佳的放大效果。
四、应用领域
SS8050因其优秀的性能和结构特点，广泛应用于诸多电子电路中，具体包括但不限于以下几个方面：
信号放大: 在音频放大器和电子传感器中，SS8050可用于增强信号，使微弱信号得到有效放大，进而传递至后续电路。
开关电路: 由于其能承受较大的电流，SS8050在开关电路中常常被用作主要的开关元件，能够高速开关，适用于继电器驱动和电机控制等场合。
LED驱动: 在LED灯具及指示灯设计中，SS8050可用于调节和控制LED的亮度，提供稳定的电流输出，使灯具能够实现预期的光强效果。
小型家电: 在自动化和控制电路中，SS8050可用作信号放大器和开关元件，帮助实现更复杂的控制功能，适用于智能家居和小型电器的应用。
五、总结
SS8050 SOT-323是一款高效的NPN三极管，凭借其优越的电气特性和小巧的封装形式，成为了众多电子产品中的重要元件。在快速发展的电子产业中，SS8050仍然具备广泛的应用前景，并将继续被工程师们广泛采用，以满足不断增长的技术需求和市场需求。手机版官网
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
