Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ MMSZ5226B
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MMSZ5226B
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MMSZ5226B
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzt)
- 28Ω
- Electronic Component
- BM0265671132
- Diode
- 1
- Current(Ir)
- 25uA
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- 3.14V~3.47V
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MMSZ5226B 稳压二极管
一、基本信息
MMSZ5226B 是一款独立式稳压二极管，主要用于电压钳位和过压保护等应用。其工作电压为 3.3V，实际稳压范围在 3.14V 至 3.47V 之间，具有较小的漏电流特性，最大漏电流为 25μA（在 1V 时）。该产品采用 SOD-123 封装，适合高密度的电子电路设计。
二、主要特点
稳压性能：MMSZ5226B 在其额定工作电压下能够提供稳定的输出电压，确保电路中的其他元器件能够在安全的电压范围内运行。其稳压范围（3.14V 至 3.47V）使其能够适应多种应用场景。
低漏电流：在设计中，漏电流是影响功耗和电路效率的重要因素。MMSZ5226B 的最大漏电流为 25μA，这意味着在设备处于待机状态时，能够有效减少功耗，从而提升整体能效。
小型化封装：SOD-123 封装使得 MMSZ5226B 在尺寸上非常紧凑，适合在空间受限的设计中使用。这种小型化设计可以帮助工程师节省 PCB 空间，增加设计灵活性。
温度稳定性：该二极管在不同温度环境下仍能保持其稳压性能，具有良好的温度系数，确保在各种工作环境中的可靠性。
易于集成：由于其小巧的设计和良好的电气性能，MMSZ5226B 可以轻松集成到各种电路中，包括但不限于消费电子、工业控制、通信设备和电源管理等领域。
三、应用场景
电源管理：在电源供应电路中，MMSZ5226B 可以作为电压参考源，提供稳定的电压输出，有效保护后级电路不受电压波动的影响。
信号钳位：在处理敏感信号的电路中，该稳压二极管能够协助限制信号电压，避免瞬时过压对其他电子元件的危险。
过压保护：在传感器或其他重要器件的保护电路中，MMSZ5226B 可以在过电压事件发生时迅速响应，保护后续电路元件不受损害。
LED 驱动电路：在 LED 照明设计中，MMSZ5226B 可用作驱动电路，确保在不同负载条件下 LED 的额定亮度不受电压波动的影响。
四、性能指标
| 参数 | 规格 |
|---|---|
| 产品型号 | MMSZ5226B |
| 工作电压 | 3.3V |
| 稳压范围 | 3.14V ~ 3.47V |
| 漏电流 (I_z @ V_z) | 25μA @ 1V |
| 封装类型 | SOD-123 |
五、总结
MMSZ5226B 稳压二极管是一款在多种应用中表现出色的电子元器件。凭借其稳压性能、低漏电流和小巧封装，该产品在现代电子设计中扮演着越来越重要的角色。无论是在高效电源管理、信号保护还是 LED 驱动等应用中，MMSZ5226B 都能为工程师提供可靠的解决方案。正因如此，选择 MMSZ5226B 不仅可以优化设计过程，还可以确保最终产品的性能和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
