WMSIC Electronic Components

cjiang(长江微电) FTC252012S6R8MBCA

ModelFTC252012S6R8MBCA
PackageSMD,2x2.5mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC252012S6R8MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC252012S6R8MBCA
Electronic Component
1
Package
SMD,2x2.5mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.065g
Inductor
6.8uH
Electronic Component
1
Electronic Component
BM0231116297
Current
1.6A
Resistor(DCR)
245mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC252012S6R8MBCA 产品概述

一、产品简介

FTC252012S6R8MBCA 是长江微电(cjiang)推出的一款表面贴装功率电感,标称电感值为 6.8µH,公差 ±20%。该器件采用小型 SMD 封装(封装尺寸 2 × 2.5 mm),面向空间受限的电源滤波与能量储存场合设计,适用于中低功率点对点电源与开关稳压电路。

二、主要电气参数

  • 电感值:6.8 µH ±20%
  • 额定电流(Irated):1.6 A(在允许的温升与工作条件下连续通过)
  • 饱和电流(Isat):2.0 A(超过此电流时电感量会显著下降)
  • 直流电阻(DCR):245 mΩ
    这些参数决定了器件在工作时的损耗、温升与电流承载能力,供设计时进行功耗与热管理评估。

三、结构与封装

本器件为贴片型功率电感,外形紧凑,典型尺寸 2 × 2.5 mm,便于高密度 PCB 布局与自动化贴装。封装端接适配常见回流焊工艺,适合卷带供料和大批量生产。

四、主要特性与优势

  • 小体积、高集成度,利于空间受限的移动设备与嵌入式电源设计。
  • 合理的额定电流与饱和电流规格,适配 1–2 A 级别的降压/升压转换器。
  • 规范的 DCR 标称值便于估算直流损耗与系统效率,便于热设计与散热管理。

五、典型应用场景

  • 移动电源与便携设备的 DC-DC 降压/升压模块
  • 工业与通信设备的输出滤波与能量储存
  • EMI 抑制、输入侧滤波以及点对点电源传输

六、使用与设计注意事项

  • 由于 DCR 较大(245 mΩ),在额定电流 1.6 A 下直流损耗约为 0.63 W(P = I^2·R),设计时需考虑器件及周边 PCB 的散热能力。
  • 饱和电流 2 A 为电感进入饱和区域的参考值,短时冲击电流可能超过额定,但长期超载会导致电感值下降并引起效率与稳定性问题。
  • 电感公差 ±20% 在精密滤波或谐振回路中需预留裕量或配合调谐元件使用。

七、封装与焊接建议

  • 建议采用符合 JEDEC 回流焊曲线的工艺,避免重复高温循环造成性能退化。
  • PCB 设计时应适当增加铜箔面积以改善散热,并按照厂商给出的 PCB 封装/焊盘建议进行布线与过孔安排。
  • 存储与回流后检测建议参照长江微电提供的检验规范。

八、替代与选型提示

在考虑更低损耗或更高电流能力时,可选择 DCR 更低或 Irated/Isat 更高的同系功率电感。选型时应综合电感值、额定电流、DCR、封装尺寸及成本进行权衡。

如需具体的 PCB 焊盘尺寸、温升曲线或典型电路应用图,请基于型号向供应商索取详细规格书与应用手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.