WMSIC Electronic Components

cjiang FNR5020S470MT

ModelFNR5020S470MT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR5020S470MT
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR5020S470MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.181g
Inductor
47uH
Electronic Component
1
Electronic Component
BM0264799445
Current
840mA
Resistor(DCR)
680mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR5020S470MT 功率电感产品概述

一 产品简介

FNR5020S470MT 是长江微电(cjiang)推出的一款磁胶屏蔽型贴片功率电感,封装尺寸约为5×5 mm,电感值为47 μH,公差±20%。该器件为面向功率滤波与能量存储的 SMD 电感,设计用于中低电流、对体积和磁泄漏有一定控制要求的应用场景。

二 主要参数

  • 电感值:47 μH ±20%
  • 额定电流(Irms):840 mA
  • 饱和电流(Isat):840 mA(在规定磁通密度下降前)
  • 直流电阻(DCR):≈680 mΩ
  • 类型:磁胶屏蔽电感(屏蔽结构)
  • 封装形式:SMD,封装尺寸约 5×5 mm
  • 品牌:cjiang(长江微电)
  • 型号:FNR5020S470MT

三 结构与材料

该电感采用磁胶(磁粉或复合铁氧体胶粘)绕线与屏蔽结构,既保证一定的磁通闭合以降低磁泄漏,又通过合理的绕组与芯材选择在有限尺寸内实现较大的电感量。SMD 封装利于自动贴片与回流焊工艺。

四 主要特性与优势

  • 小型化:5×5 mm 封装在板级功率滤波中占用空间小,适合高密度布局。
  • 屏蔽性好:磁胶屏蔽结构能有效抑制磁泄漏,对邻近元件干扰较小。
  • 稳定的电气性能:47 μH 的电感值配合 840 mA 的额定与饱和电流,适用于中低电流的滤波与储能场景。
  • 可回流焊兼容:适用于主流 SMT 制程,便于批量制造与装配。

五 典型应用

  • 开关电源输入/输出滤波(中低功率 DC–DC)
  • 电源管理模块的共模/差模滤波(根据电路拓扑选择)
  • 工业控制、消费电子、通信设备中的电源滤波与去耦
  • 抗干扰设计中对磁干扰敏感区域的局部抑制

六 选型建议与注意事项

  • 电流裕量:额定电流与饱和电流均为840 mA,应用中应预留裕量,避免长期在额定值附近工作以防温升与磁饱和。
  • DCR 考虑:直流电阻约680 mΩ,会带来功耗与压降,设计电流与效率时需考虑该损耗。
  • 温度与频率特性:实际电感随温度与绕组频率会变化,关键电路应在目标工作温度与频段下进行仿真或实测。
  • 布局:靠近热源或高电流走线布置时注意散热与机械应力,尽量短而粗的走线连接以降低附加寄生阻抗。

七 封装与可靠性

FNR5020S470MT 适配常规 SMD 贴片与回流焊流程。建议遵循元器件厂家的焊接温度与回流曲线(避免长时间高温),板面焊盘需保证良好焊点并避免在焊接后对器件施加机械冲击。长期可靠性受温升、过电流与环境湿度影响,关键应用推荐做加速老化与热循环验证。

如需器件阻抗曲线、频率响应或回流曲线等更详细的电气与工艺资料,可联系长江微电获取官方数据手册与应用参考。

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