WMSIC Electronic Components

cjiang FTC404030S3R3MGCA

ModelFTC404030S3R3MGCA
PackageSMD,4.1x4.1mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC404030S3R3MGCA
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC404030S3R3MGCA
Electronic Component
1
Package
SMD,4.1x4.1mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.574g
Inductor
3.3uH
Electronic Component
1
Electronic Component
BM0265023333
Current
5.3A
Resistor(DCR)
35mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
8.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC404030S3R3MGCA 产品概述

一、产品简介

FTC404030S3R3MGCA 是长江微电(cjiang)推出的一款面向高电流开关电源和点对点电源模块的贴片功率电感。该器件采用 T-CORE + 扁线绕制工艺,体积紧凑(SMD 封装,外形尺寸 4.1 × 4.1 mm),在保证感量的同时实现极低的直流电阻(DCR)和较高的饱和电流能力,适合对效率和热性能要求严格的应用场景。

二、主要技术参数

  • 标称电感值:3.3 μH(公差 ±20%)
  • 额定电流(Irated):5.3 A(连续工作电流,参考值)
  • 饱和电流(Isat):8.5 A(感量降低到初始值的一定比例时的峰值极限)
  • 直流电阻(DCR):约 35 mΩ(典型值,测试温度与测量方法请参考厂方数据)
  • 封装形式:SMD,尺寸 4.1 × 4.1 mm
  • 品牌:cjiang(长江微电)
  • 特色描述:T-CORE + 扁线工艺、超大电流、超低 DCR

三、结构与工艺特点

  • T-CORE 磁芯结构:有助于在小体积下提供稳定的电感值和较好的磁通承载能力,抑制磁饱和和噪声。
  • 扁线绕制工艺:扁线使得导体截面积更大、且对流场分布更优,从而显著降低 DCR,减小 I²R 发热,提高效率。
  • SMD 封装:利于自动化贴装和回流焊工艺,便于在高密度 PCB 上布置。整体尺寸小,便于空间受限的系统设计。

四、典型应用场景

  • 同步降压转换器(Buck converters)、点对点(POL)电源模块
  • 服务器与通信设备的电源子系统
  • 高功率 LED 驱动电源
  • 电池管理与电源模块(需大电流且关注效率场合)
  • 工控和汽车电子(需注意具体车规认证与温度范围)

五、设计选型与注意事项

  • 电流选型:将额定电流 5.3 A 作为连续工作参考,建议在实际系统中留有裕量(通常 15–30%),以应对温升、谐波电流和长期漂移。Isat = 8.5 A 为峰值限值,不应长期在该电流水平下运行。
  • 感值公差:±20% 在开关电源反馈回路设计中需要考虑,必要时通过 PCB 布局和控制环路补偿保证稳态和瞬态性能。
  • DCR 与损耗:35 mΩ 的低 DCR 有利于减小铜损和温升,提高转换效率,但在高频换流下还需考虑涡流和磁芯损耗对总体损耗的贡献。
  • 温度影响:DCR 会随温度上升,实际工作时请参考厂方温度系数并预估额外损耗。对高环境温度场景建议增加散热或降低额定工作电流。

六、布局与散热建议

  • 将电感放置在靠近开关器件或输出端的位置,以缩短电感与 MOSFET/整流器之间的高频回路路径,减小环路电感和 EMI。
  • 使用较宽的铜箔和多层铜层过孔(thermal vias)以增强散热能力和降低串联电阻。
  • 焊盘设计遵循厂方推荐焊盘尺寸与焊锡窗,以保证良好焊接和热传导;回流焊曲线按通用无铅工艺处理并参照规格书。
  • 注意邻近元件间距,避免热耦合导致温度上升过快。

七、可靠性与测试建议

  • 在样机验证阶段,应进行长时间满载与不同环境温度下的热稳定性测试,监测电感温升和 DCR 变化。
  • 对于含有脉冲大电流的系统,需进行峰值电流循环测试以确认无磁芯饱和或线圈位移问题。
  • 建议进行 EMI 测试与开环/闭环瞬态响应测试,验证该电感在目标电路中的综合表现。

八、订购与替代

  • 订购型号:FTC404030S3R3MGCA,品牌 cjiang(长江微电)。
  • 在替代选型时,优先匹配电感值、额定/饱和电流、DCR 及封装尺寸,若需提高可靠性可考虑更大额定电流或更低 DCR 的型号。
  • 最终选型和工艺参数(如回流曲线、耐压与耐温规格)请以厂方官方规格书为准,并与供应商确认样品及批量供货能力。

总结:FTC404030S3R3MGCA 以其 T-CORE+扁线结构、超低 DCR 及较高饱和电流能力,适合用于要求高效率与高电流容忍的开关电源与点对点供电场景。合理的选型裕度、良好的 PCB 布局与散热设计是发挥其性能的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.