WMSIC Electronic Components

cjiang FNR5020S150MT

ModelFNR5020S150MT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR5020S150MT
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR5020S150MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.181g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0264553415
Current
1.3A
Resistor(DCR)
215mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR5020S150MT — 5×5mm 15µH 功率磁胶屏蔽电感(长江微电)

一、产品简介

FNR5020S150MT 是长江微电(cjiang)推出的一款小封装、高可靠性的功率屏蔽电感,额定电感量 15µH(公差 ±20%),面向小型开关电源、负载滤波和电源管理应用。SMD 贴装、5×5mm 尺寸,适合高密度 PCB 布局需求。

二、主要电气参数

  • 电感值:15 µH ±20%
  • 额定直流电流(Irated):1.3 A
  • 饱和电流(Isat,指定降幅标准处):1.4 A
  • 直流电阻(DCR):≈215 mΩ
  • 封装:SMD,尺寸标称 5×5 mm
  • 类型:磁胶屏蔽(屏蔽式功率电感)

三、结构与封装说明

该器件采用磁性材料与屏蔽结构结合设计,减小外磁场泄漏,适合对 EMI 要求较高的系统。SMD 封装方便自动贴装与回流焊工艺,5×5mm 的占板面积在小型化电源模块中具有较好平衡。

四、性能及使用要点

  • 饱和特性:靠近 Isat 时电感量会明显下降,建议实际工作电流留有裕量(常建议 70%–85% 的额定电流范围内运行)。
  • 损耗与发热:基于 DCR,可近似估算铜损 Pcu ≈ I^2·DCR;在 1.3 A 时约为 0.36 W,实际温升与散热条件相关,需在应用中验证。
  • 高频特性:屏蔽结构有利于抑制辐射,但电感随频率与直流偏置会变化,实际滤波/谐振点应以实验测量为准。
  • 可焊性:兼容常规 SMD 回流焊流程,建议遵循制造商的焊接温度曲线和储存/回流注意事项。

五、典型应用场景

  • 降压(Buck)/ 升压(Boost)DC-DC 转换器的输出滤波或能量储存元件
  • 手机、可穿戴、物联网终端等小型电源模块
  • LED 驱动电源与电源管理模块的输入/输出滤波
  • 对 EMI 有要求的模块化电源设计

六、选型与布局建议

  • 电流裕量:若系统存在峰值电流或需要较小温升,应选择更高额定电流或更低 DCR 的型号。
  • PCB 布局:将电感放置在开关 MOSFET 与输出电容之间,回路尽量短且铜箔宽,减少寄生电感与噪声。必要时在电感下方配置散热铜箔或过孔以改善散热。
  • 测试验证:在目标工作温度与最大负载条件下测量电感值、温升与输出纹波,以确认满足系统要求。

七、可靠性与封装注意

  • 存储与回流:避免长时间潮湿环境暴露,回流焊遵循 IPC/JEDEC 建议。
  • 机械应力:SMD 器件在波峰/回流焊及机械振动条件下应注意焊盘与封装应力破坏风险,按 PCB 可靠性设计焊盘尺寸与焊膏量。
  • 质量验证:建议在样机阶段进行温升、寿命与冲击振动测试,确认在目标应用下的可靠性。

总结:FNR5020S150MT 提供在 5×5mm 小封装内可观的 15µH 储能能力,适合中低功率(≈1 A 量级)开关电源与滤波场合。选择与布局时应重视直流偏置导致的电感下降与 DCR 引起的发热,预留裕量并做实际验证以确保长期稳定运行。

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