WMSIC Electronic Components

cjiang FNR4020S6R2MT

ModelFNR4020S6R2MT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR4020S6R2MT
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR4020S6R2MT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.245g
Inductor
6.2uH
Electronic Component
1
Electronic Component
BM0264754175
Current
1.6A
Resistor(DCR)
150mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR4020S6R2MT 产品概述

一、产品简介

FNR4020S6R2MT 是长江微电(cjiang)面向电源滤波与能量储存应用推出的一款磁胶屏蔽功率电感。标称电感量为 6.2 μH,公差 ±20%,为表面贴装(SMD)封装,外形尺寸为 4×4 mm,适合对体积、成本和可靠性有较高要求的消费电子与通信类电源模块。

二、主要技术参数

  • 电感值:6.2 μH(±20%)
  • 额定电流:1.6 A(温升与温度环境下的持续工作电流)
  • 饱和电流(Isat):2.3 A(电感量下降至初始值的某一比例时的电流)
  • 直流电阻(DCR):150 mΩ
  • 类型:磁胶屏蔽电感(屏蔽结构,抑制漏磁)
  • 封装:SMD,尺寸 4×4 mm
  • 品牌:cjiang(长江微电)
  • 型号:FNR4020S6R2MT

三、特点与优势

  • 紧凑尺寸:4×4 mm 的 SMD 封装,便于高密度 PCB 设计与批量自动贴装。
  • 良好屏蔽性:磁胶屏蔽结构可降低对周边元件的磁干扰,适合靠近敏感信号线布局。
  • 中等功率承载:1.6 A 的额定电流与 2.3 A 的饱和电流,为小型 DC-DC 降压/升压模块和电源滤波提供可靠的电流余量。
  • 适用广泛:适合各类便携设备、LED 驱动、电源管理模块与通信设备的输入/输出滤波或能量储存。

四、典型应用

  • 升降压(Boost/Buck)开关电源的储能电感与输出滤波
  • 电源噪声抑制与 EMI 滤波
  • 移动终端、物联网模块、通信设备及小功率 LED 驱动
  • 电池供电系统的局部电源设计

五、选型与使用建议

  • 电流裕量:建议在实际工作电流低于额定电流(1.6 A)且远低于饱和电流(2.3 A)的条件下使用,以避免电感饱和导致性能下降。
  • 考虑温升与损耗:DCR 为 150 mΩ,会产生一定的铜损与温升,设计时需评估功率损耗与散热条件,必要时按环境温度进行电流降额。
  • 滤波与纹波电流:若用于开关电源,其纹波电流成分会加速发热,需关注纹波峰值是否接近 Isat。
  • 与电容配合:输出滤波时与低 ESR 电容配合,能获得更好的输出纹波抑制效果。

六、封装与焊接注意事项

  • 推荐采用标准回流焊工艺,遵循制造商的回流曲线与湿气敏感级别(MSL)要求。若无具体曲线,请遵循通用无铅回流温度规范并先做小批量验证。
  • PCB 布局:电感应尽量靠近开关管或负载端,缩短信号回流路径;为改善散热,可在下侧敷铜或增加过孔扩散热量。
  • 储存与搬运:避免受潮与强磁场环境,贴片过程中注意防止机械挤压导致外观或内部结构损伤。

若需完整数据手册(如频率相关的电感曲线、饱和定义、热阻或回流曲线),建议联系长江微电获取原厂资料以便进行精确设计验证。

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