WMSIC Electronic Components

cjiang FTC201210S1R0MBCA

ModelFTC201210S1R0MBCA
PackageSMD,1.2x2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC201210S1R0MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC201210S1R0MBCA
Electronic Component
1
Package
SMD,1.2x2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.04g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0258760354
Current
3.9A
Resistor(DCR)
55mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC201210S1R0MBCA 产品概述

一、产品简介

FTC201210S1R0MBCA 为长江微电(cjiang)推出的一款功率贴片电感,标称电感值 1.0 μH,公差 ±20%,面向紧凑型开关电源与电源管理场景设计。该器件以其微小的封装(1.2 × 2 mm)和接近 4 A 的电流能力,为移动终端、便携设备和高密度电源模块提供了空间与性能的均衡方案。

二、主要性能参数

  • 电感值:1.0 μH ±20%
  • 额定电流(Ir):3.9 A(连续工作参考值)
  • 饱和电流(Isat):4.0 A(超过此值时电感量显著下降)
  • 直流电阻(DCR):约 55 mΩ(典型)
  • 封装形式:SMD,外形尺寸 1.2 × 2 mm
  • 品牌:cjiang(长江微电)

上述参数表明该电感在保持较小体积的同时,具备较高的电流处理能力与相对较低的导体损耗,适合用于中高电流、空间受限的电源拓扑。

三、结构与封装特性

FTC201210S1R0MBCA 采用表面贴装封装,体积小,便于自动化贴装和回流焊工艺,利于实现高密度 PCB 布局。封装尺寸 1.2×2 mm 使其非常适合板面空间紧张的消费电子产品,如智能穿戴、手机模组、电源管理子板等。DCR 55 mΩ 的设计在降低 I²R 损耗与控制温升方面取得平衡,但在高效率要求场合仍需结合布局和散热方案综合评估。

四、典型应用场景

  • 同步降压(buck)转换器的电感元件
  • 升压(boost)及升降压(buck-boost)电源模块
  • 模块化电源管理(PMIC)输入/输出滤波与储能
  • 移动设备、便携式电源与可穿戴设备电源部分
  • 工业控制与通讯设备中空间受限的功率通路

该器件尤其适合需要兼顾体积与电流处理能力的应用场景,在中低电压、高开关频率的开关电源中能发挥良好效果。

五、选型建议与注意事项

  1. 电流裕度:额定电流 3.9 A 为器件连续工作参考,饱和电流 4.0 A 为磁芯开始进入饱和的临界值。建议在设计中保留一定裕度(例如 10%–30%),以避免脉冲峰值或温度升高导致的性能退化。
  2. DCR 与效率:55 mΩ 的 DCR 在同级别产品中属中等偏低水平,但在高效率设计中仍会造成明显 I²R 损耗。应结合功率损耗预算与散热设计评估是否满足系统要求。
  3. 工作频率:虽然该型号针对开关电源优化,但具体效率和纹波特性会随开关频率、峰值电流和电路布局变化。请在样机验证阶段关注电感损耗与磁饱和行为。
  4. 温升与散热:在高平均电流下,电感内部 DCR 导致的发热不可忽视。建议在 PCB 布局时为电感附近提供良好的铜箔散热路径与足够的空气流动空间。
  5. 串联/并联:对于更高的电流需求,可考虑并联多个电感或选用 DCR 更低、Isat 更高的型号;但并联电感需注意电感值匹配与谐振问题。

六、装配与可靠性建议

  • 焊接工艺:适用于标准回流焊工艺,建议遵循器件制造商或通用 JEDEC 回流曲线以避免焊接热应力导致的性能异常。
  • 布局建议:尽量缩短电感与功率开关器件(MOSFET、整流器)之间的走线,减小环路面积以降低 EMI。
  • 测试验证:在开发阶段应做热成像与长时间运行测试,监测温度、感值漂移与效率表现,确保在实际工作工况下满足可靠性要求。
  • 环境适应:对于苛刻环境(高温、高湿、强振动),建议与供应商确认元件的环境等级与寿命认证。

七、总结

FTC201210S1R0MBCA(1.0 μH,±20%,Ir 3.9 A,Isat 4.0 A,DCR 55 mΩ,SMD 1.2×2 mm)为追求小体积与较高电流能力的开关电源设计提供了实用的功率电感方案。合理的选型与电路布局能充分发挥其在效率、功率密度和可靠性方面的优势,适合移动设备、模块化电源与工业电子等多种应用场景。购买与批量使用前,建议在目标电路中进行样机验证以确定最终性能。

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