WMSIC Electronic Components

cjiang FCD32-2R2M FCD32

ModelFCD32-2R2M
PackageSMD,3.5x3.0x2.1mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FCD32-2R2M
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FCD32-2R2M
Electronic Component
1
Package
SMD,3.5x3.0x2.1mm
Type
Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.174g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0258614578
Resistor(DCR)
80mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FCD32-2R2M 产品概述

FCD32-2R2M 是长江微电(cjiang)出品的一款贴片型非屏蔽功率电感,封装尺寸为 3.5 × 3.0 × 2.1 mm,面向开关电源及电流滤波等场合。器件以 2.2 µH 标称电感值、±20% 公差、2.2 A 饱和电流(Isat)和约 80 mΩ 的直流电阻(DCR)为主要电气特性,适用于中小功率 DC-DC 转换器和电源滤波网络。

一、主要参数一览

  • 型号:FCD32-2R2M
  • 品牌:cjiang(长江微电)
  • 封装:SMD,尺寸 3.5 × 3.0 × 2.1 mm
  • 电感值:2.2 µH(标称)
  • 精度:±20%
  • 饱和电流(Isat):2.2 A(定义通常为电感下降到初始值某一百分比时的电流,具体以厂家定义为准)
  • 直流电阻(DCR):约 80 mΩ
  • 类型:非屏蔽(open magnetic structure)

二、性能要点与工作特性

  • 电感值与公差:2.2 µH ±20% 满足一般开关稳压器对能量存储与滤波的需求。公差较宽,适合成本敏感且对精度要求不高的应用。
  • 饱和特性:2.2 A 的 Isat 表明在接近或超过该电流时电感将出现明显下降,设计时应留有裕量以避免核心饱和导致效率和输出纹波恶化。
  • 损耗与热量:约 80 mΩ 的 DCR 会在通过电流时产生功耗(P = I^2 × DCR),设计时需计算功耗并评估器件温升与周围元件的散热条件。
  • 非屏蔽结构:非屏蔽电感体积小、成本低,但漏磁相对较大,可能对敏感电路造成干扰,布局时应考虑屏蔽或间隔措施以降低 EMI 影响。

三、典型应用场景

  • 同步/非同步降压(Buck)DC-DC 转换器的输出滤波电感。
  • 电源前端或后端的 EMI 滤波与能量储存。
  • 移动设备、通信设备和嵌入式系统中对中等电流、电感值需求的电源模块。
  • 一般功率管理模块、LED 驱动器、小型电机驱动等。

四、布局与焊接建议

  • PCB 布局:将电感尽量靠近开关器件(例如 MOSFET 或开关管)和输出电容,以缩短高 di/dt 回路,减少寄生电感与辐射。
  • EMI 管理:由于非屏蔽结构可能产生较大漏磁,敏感信号线应避开电感附近;必要时在 PCB 上增加地平面或金属遮罩。
  • 焊接工艺:遵循无铅回流曲线,避免过高的峰值温度与过长的温度暴露,防止绕线或粘结材料受损。具体回流温度曲线请参考厂商推荐的封装焊接说明。
  • 焊盘与黏贴:推荐使用良好接地的铜箔以帮助散热,并保证可靠的焊接接触,避免悬空或应力集中导致机械失效。

五、选型建议与注意事项

  • 电流裕量:工作电流应低于 Isat,通常推荐留有 20%~50% 的裕量,若工作电流接近饱和值需选用更大 Isat 的型号。
  • 损耗评估:在高电流应用中,DCR 引起的 I^2R 损耗会显著影响效率与发热,应计算实际功耗并评估热管理需求。
  • 耐压与稳定性:在高频应用中,电感的频率特性(如高频阻抗、磁芯损耗)会影响输出纹波与效率,复杂系统建议向厂家索取频率特性曲线与样品做实测。
  • EMI/噪声控制:若系统对辐射敏感,应考虑屏蔽型电感或在布局中采取隔离与滤波措施。

六、可靠性与测试建议

  • 建议在最终应用环境下进行热循环、功率循环和寿命测试,验证在实际工作温度与电流下的稳定性。
  • 测试项目包括:DCR 测量、感值随 DC 偏置的变化、饱和电流点验证、温升测试以及在板级的 EMI 测试。
  • 对于批量生产零件,建议与供应商确认批次一致性与放行测试规范。

七、采购与技术支持

  • 在选型和量产前,建议索取厂商的详细技术规格书(datasheet)与样品进行验证。
  • 若需替代型号或更高 Isat / 更低 DCR 的规格,可与长江微电或代理商沟通以获取推荐替代件与定制方案。

FCD32-2R2M 以小尺寸和适中电流承载能力适配多种中小功率应用;在实际使用中请结合电流裕度、散热与 EMI 要求进行合理选型与 PCB 布局,确保系统稳定与可靠。

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