WMSIC Electronic Components

cjiang FTC322520S3R3MBCA

ModelFTC322520S3R3MBCA
PackageSMD,2.5x3.2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC322520S3R3MBCA
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC322520S3R3MBCA
Electronic Component
1
Package
SMD,2.5x3.2mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.14g
Inductor
3.3uH
Electronic Component
1
Electronic Component
BM0264590554
Current
4.5A
Resistor(DCR)
60mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC322520S3R3MBCA 产品概述

一、产品简介

FTC322520S3R3MBCA 是长江微电(cjiang)推出的一款小型化一体成型 T-CORE 功率电感,感值 3.3 μH(±20%),额定电流 4.5 A,饱和电流 Isat 4.5 A,直流电阻 DCR 约 60 mΩ。封装为表面贴装 SMD,外形尺寸 2.5 × 3.2 mm,采用扁线工艺与整体成型结构,针对空间受限且需兼顾较高电流能力的电源滤波与降压应用优化设计。

二、主要特性

  • 感值:3.3 μH,容差 ±20%;
  • 额定/饱和电流:4.5 A(在靠近饱和点时建议留有余量以保证线性工作);
  • 低 DCR:约 60 mΩ,降低铜耗与热升高;
  • 体积小:2.5 × 3.2 mm SMD 封装,适合高密度 PCB 布局;
  • 结构:一体成型 T-CORE,机械强度高,抗振动性能好;
  • 导线工艺:扁线绕制,减小交流损耗,提高热散能力;
  • 可回流焊接,适应常见 SMT 生产工艺。

三、典型应用场景

  • 同步降压转换器(buck)输出电感;
  • 电源输入滤波与电压稳压模块(VBUS、DC-DC 模块);
  • 移动终端、网络设备、工业控制与汽车电子中对体积与电流有双重要求的电源设计;
  • 高密度多相电源模块中的空间受限位。

四、电气与热设计建议

  • 饱和裕量:尽量保证工作峰值电流低于 Isat 的 80%~90%,以避免感值突降影响输出纹波与控制回路稳定;
  • 热管理:DCR 60 mΩ 会在高电流下产生显著 I^2R 损耗,建议对热源进行仿真并在 PCB 上安排散热铜箔或过孔分散热量;
  • 纹波电流与损耗:考虑交流损耗与磁芯损耗,按实际开关频率和电流波形评估发热;
  • 布局建议:电感与开关器件(MOSFET、输出电容)应尽量靠近,减小环路面积,降低 EMI 干扰。

五、封装与使用注意

  • 封装尺寸:2.5 × 3.2 mm SMD,适配常规贴片机装配;
  • 焊接工艺:支持标准回流焊,建议遵循无铅回流曲线并控制峰值温度与保温时间以防封装应力;
  • 机械可靠性:一体成型设计提升抗振与抗机械应力能力,但仍建议在强振动或冲击环境下进行可靠性验证;
  • 储存与处理:避免潮湿环境,按工业级器件常规干燥保存并在贴装前按要求烘烤。

六、优势总结

  • 极小占板面积,在有限空间内提供相对较高的额定电流能力;
  • 扁线工艺与低 DCR 设计,降低损耗与热升;
  • 一体成型 T-CORE 提供良好一致性与机械强度,适合批量自动化生产。

若需器件数据手册(PDF)、封装尺寸图或样品封装建议,请提供联系方式或具体需求,以便获取更详细技术资料与推荐电路。

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