WMSIC Electronic Components

cjiang FNR252010S1R0NT

ModelFNR252010S1R0NT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR252010S1R0NT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR252010S1R0NT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±30%
Electronic Component
0.046g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0264799452
Current
1.8A
Resistor(DCR)
108mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR252010S1R0NT — 1µH 磁胶屏蔽型功率电感产品概述

一、产品简介

FNR252010S1R0NT 是长江微电(cjiang)推出的一款表面贴装磁胶屏蔽功率电感,标称电感值 1µH,公差 ±30%,专为中小功率电源滤波与能量储存场合设计。器件采用 252010(俗称 1008)封装,适配高密度 PCB 与自动贴装生产线,兼具体积小、工艺稳定与屏蔽性能好等特点。

二、主要电气参数

  • 电感值:1µH ±30%
  • 额定电流(Irms):1.8A(建议长期通流上限,请结合散热与降额规则)
  • 饱和电流(Isat):2.2A(在此电流下电感显著下降,应避免长期工作)
  • 直流电阻(DCR):108mΩ(典型值,影响功耗与温升)
  • 类型:磁胶屏蔽电感(利于降低磁泄漏与电磁干扰)
  • 封装:SMD,252010(2.5×2.0mm)适配自动化生产

三、产品特点与优势

  • 小尺寸高集成:252010 封装在保证容积效率的同时,便于在有限空间内实现滤波与储能功能。
  • 良好屏蔽性:磁胶屏蔽工艺可减少对周边器件的磁干扰,适合对 EMI 要求较高的系统。
  • 中等功率能力:1.8A 的额定电流满足移动电源、蓝牙音频、LED 驱动与低功耗 DC-DC 模块等常见应用。
  • 可控饱和特性:2.2A 的饱和电流提供一定的瞬态承受能力,但仍需留有余量以避免磁饱和造成性能骤降。

四、典型应用场景

  • 降压/升压 DC-DC 转换器的输入/输出滤波与储能
  • 电源管理模块(PMIC)周边滤波
  • 便携设备与物联网终端的电源滤波组件
  • 白光 LED 驱动、消费电子与通信终端的电流滤波与抗干扰

五、设计与使用建议

  • 降额使用:建议将长期工作电流控制在额定电流 1.8A 以下,并考虑环境温度与散热条件对 DCR 导致的温升影响。
  • 电感衰减:在高直流偏置下电感值会下降,特别是在接近额定电流时,请在仿真/测量中考虑 DC-bias 特性。
  • 布局注意:为发挥屏蔽效果,尽量将电感的磁场干扰敏感元件(如精密 ADC)隔离,走线短且粗,降低寄生阻抗。
  • 焊接工艺:推荐遵循厂家回流焊温度曲线及工艺规范,避免超温或长时间过热造成封装应力。
  • 测试与验证:在最终应用中进行温升、纹波电流、以及 EMI 测试,确保在实际工作条件下满足系统指标。

如需完整规格书、频率响应曲线、DC-bias 数据或样品测试报告,可联系供应商或长江微电技术支持获取详细资料。

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