WMSIC Electronic Components

cjiang FTC121065S2R2MBCA

ModelFTC121065S2R2MBCA
PackageSMD,1x1.2mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC121065S2R2MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC121065S2R2MBCA
Electronic Component
1
Package
SMD,1x1.2mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.031g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0258614551
Current
1A
Resistor(DCR)
280mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
1.3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC121065S2R2MBCA 产品概述

一、产品简介

FTC121065S2R2MBCA 是长江微电(cjiang)推出的一款表面贴装功率电感,封装尺寸小巧(SMD,1.0 × 1.2 mm),适用于空间受限的便携与物联网终端电源设计。额定电流 1A,电感值 2.2 μH,主要用于开关稳压、滤波与能量储存场合。

二、主要参数

  • 品牌:cjiang(长江微电)
  • 型号:FTC121065S2R2MBCA
  • 电感值:2.2 μH ±20%
  • 额定电流(Ir):1.0 A
  • 饱和电流(Isat):1.3 A(磁芯磁通密度下降到规定值时)
  • 直流电阻(DCR):约 280 mΩ
  • 封装:SMD,尺寸 1.0 × 1.2 mm

三、特点与优势

  • 体积极小,便于高密度 PCB 布局与多层小型产品集成。
  • 适合低功率、低噪声电源应用,具有不错的抗饱和能力(Isat 1.3A)。
  • 直流电阻较低,能量损耗与温升可控,适合 1A 级别稳压器使用。
  • 标准化生产,适合自动贴装与回流焊工艺。

四、典型应用

  • 移动设备和可穿戴终端的降压转换器(Buck)滤波与储能。
  • 物联网节点、电池供电模块的电源管理。
  • LED 驱动与小功率电源模块的输入/输出滤波。
  • 医疗便携设备、传感器前端电源解决方案。

五、封装与机械信息

  • SMD 1.0 × 1.2 mm 小尺寸封装,适配常见贴片生产线。
  • 建议参考厂商提供的封装图与焊盘推荐尺寸,以保证焊点可靠性与热力学匹配。

六、选型与使用建议

  • 额定电流 1A 为长期连续工作限制,设计时建议按实际工作电流保留 20~30% 余量以降低发热与延长寿命。
  • 对于存在瞬态冲击电流的场景,应关注饱和电流 Isat(1.3A),避免在冲击时进入严重饱和区。
  • 若对纹波电流或效率要求更高,可考虑更低 DCR 或更大电流等级的同系列器件。

七、焊接与 PCB 布局建议

  • 推荐采用标准无铅回流焊曲线,遵循厂商回流说明以避免过热损伤。
  • 布局时使电感与电源开关、输出电容尽量靠近,缩短信号环路以降低 EMI。
  • 使用足够的铜面积与散热层来降低温升,必要时在器件下方或附近布置过孔导热至内层/底层。

八、质量与可靠性

  • 建议索取并参考厂家的可靠性测试报告(高低温循环、振动、湿热与焊接热稳定性)。
  • 在关键产品导入前,进行样机评估与长期老化测试,验证在目标工作温度与频率下的性能稳定性。

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