WMSIC Electronic Components

cjiang FNR252012S1R0NT

ModelFNR252012S1R0NT
PackageSMD
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNR252012S1R0NT
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNR252012S1R0NT
Electronic Component
1
Package
SMD
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±30%
Electronic Component
0.046g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0264590565
Current
2.1A
Resistor(DCR)
90mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNR252012S1R0NT 产品概述

一、产品简介

FNR252012S1R0NT 是 cjiang(长江微电)推出的一款片式磁胶屏蔽功率电感,标称电感值 1.0 µH,公差 ±30%。该器件采用 SMD 1008 封装(常见片式尺寸),面向中小功率 DC-DC 变换器和电源滤波应用,兼顾体积与通流能力,适用于对空间和 EMI 有一定要求的场合。

二、主要参数与电气特性

  • 电感值:1.0 µH ±30%
  • 额定电流(Irated):2.1 A(长期允许通过电流,需考虑温升)
  • 饱和电流(Isat):2.9 A(电感下降至初始值一定比例时定义)
  • 直流电阻(DCR):约 90 mΩ(典型值)
  • 类型:磁胶封装、屏蔽结构
  • 封装形式:SMD(1008)

三、性能特点

  • 抗饱和能力较强:Isat 2.9 A,适合有瞬态大电流冲击的开关电源场合。
  • 低频损耗可控:90 mΩ 的 DCR 在中小电流下损耗合理,有利于降低导通损耗。
  • 屏蔽结构:磁胶封闭与屏蔽设计减少外部磁场干扰,便于密集布板与 EMC 控制。
  • 片式封装:适合自动贴装和回流焊工艺,便于批量生产与装配。

四、典型应用场景

  • 升降压(Buck/Boost)和降压(Buck)DC-DC 转换器的主电感或输出滤波。
  • 移动电源、便携设备、物联网终端的电源管理。
  • 工业控制与通信设备中点对点电源模块的滤波与储能元件。
  • 在对 EMI 有要求且通流不到几安的中小功率场合替代传统绕线电感。

五、选型与使用建议

  • 电流余量:建议额定电流 Irated 留有 20% 以上余量,若工作电流连续接近额定值,应评估温升与寿命。
  • 饱和裕度:若电路存在大脉冲电流或短时峰值,应以 Isat 为界,保证峰值不超过 Isat,避免电感值突降影响稳定性。
  • 损耗评估:根据工作电流平方乘以 DCR 计算铜损,并结合开关损耗评估总体效率。
  • 工作频率:在开关电源常见工作频率范围内(几百 kHz 范围)表现良好,具体纹波电流与频率下的差异需参考厂方曲线。
  • 布局建议:电感靠近开关管或输出端放置,保证回流环路最短,输入/输出电容靠近电感两端。

六、封装、可靠性与注意事项

  • 适用于标准回流焊工艺,但需按厂家推荐的温度曲线进行焊接,避免过高回流温度影响磁胶或粘接材料。
  • 屏蔽结构降低磁干扰,但仍建议在高精度模拟电路附近作适当间隔或屏蔽处理。
  • 储存与焊接环境避免潮湿,高湿可能影响封装质量,应遵循物料防潮等级和回流前的烘烤要求。
  • 在关键应用建议索取并参考厂方详细数据手册(电感随偏磁通、温度系数、饱和特性曲线及频率特性),并做实际电路测试验证。

FNR252012S1R0NT 以其尺寸优势、适度的通流能力与屏蔽特性,适合中小功率开关电源和电源滤波场合,是注重体积与 EMC 控制的优选电感元件。

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