Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402X5R105K500AT是三环电子(CCTC) 推出的通用型贴片多层陶瓷电容(MLCC),针对中低电压、中等容值需求的电子电路设计,兼顾温度稳定性与成本优势,广泛适配消费电子、通信及工业控制等领域的滤波、耦合及去耦场景。
产品型号各代码明确对应核心参数:
产品采用0402英制贴片封装(公制1005),物理尺寸精度严格:
端电极采用三层结构(银层+镍层+无铅锡层):
包装为8mm宽编带卷盘,常见规格10,000片/盘,适配自动化贴装生产线。
温度稳定性突出
X5R介电材料的温度特性优于Y5V等通用型材料,在-55℃~+85℃范围内容值波动≤±15%,可避免极端温度下电路性能漂移(如电源滤波失效)。
高频响应优异
0402封装寄生电感、电阻极小(典型值:电感<1nH,电阻<0.1Ω),响应速度快,适合射频电路、高速数字电路的滤波需求。
可靠性经严格验证
每批次产品通过三环电子的全检+抽样可靠性测试:
环保合规
不含铅、镉等有害物质,符合欧盟RoHS 2.0、REACH及中国GB/T 2693等环保标准。
三环电子(CCTC)是国内MLCC领域老牌制造商,拥有60余年研发生产经验,产品覆盖0201~1206全系列封装。TCC0402X5R105K500AT采用自动化生产工艺,每批次均通过一致性测试,可满足批量生产的稳定性需求。
该产品以高性价比、稳定的温度特性,成为中低端电子电路的理想滤波/耦合解决方案,适配多数常规电子设备的设计需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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