Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0201X7R331K500ZT是三环电子(CCTC)推出的多层陶瓷贴片电容(MLCC),型号各部分含义清晰:
该电容关键参数完全满足中低端电子设计的常规需求,具体如下:
参数项 规格值 备注 标称容值 330pF(331) 误差±10%(K级) 额定电压 50V DC 交流电压需按80%降额使用 温度系数 X7R 工作温度-55℃~+125℃ 封装尺寸 0201(英制) 公制0.6×0.3×0.3mm 介质类型 多层陶瓷(MLCC) 无极性设计 环保标准 RoHS 6/6、REACH 符合欧盟环保要求 工作频率范围 0~1GHz(典型) 适合射频/低频电路0201封装是目前高密度PCB设计的主流选择,体积仅为0204(0.8×0.4mm)的约50%,可显著节省电路板空间,适配智能手机、智能穿戴等小型化产品。
采用交替叠放陶瓷介质层+内电极层的核心工艺,实现「高容值+小型化」的平衡:
该电容兼顾「小型化+稳定性」,广泛用于以下领域:
三环电子(CCTC)是国内MLCC行业骨干企业,该产品可靠性通过多重验证:
实际工作电压(直流/交流峰值)≤额定电压的80%(即40V),避免长期过压导致电容老化失效。
MLCC为静电敏感元件(ESD等级Class 1~2),操作时需佩戴防静电手环、使用防静电工作台。
TCC0201X7R331K500ZT是一款高性价比小型化MLCC,适合对体积、稳定性有要求的中低端电子设计,广泛覆盖消费电子、通信、工业等领域,是PCB密度优化的理想选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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