WMSIC Electronic Components

CCTC TCC1206X7R334K500DT

ModelTCC1206X7R334K500DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X7R334K500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R334K500DT
Electronic Component
1
Electronic Component
330nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264935663
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R334K500DT 贴片陶瓷电容产品概述

一、产品核心身份与基本参数

TCC1206X7R334K500DT是三环电子(CCTC) 推出的通用型贴片陶瓷电容,针对中低压电路的滤波、耦合、去耦场景优化设计。核心参数明确可查:

  • 封装规格:1206(英制,对应公制3.2mm×1.6mm);
  • 介质材质:X7R(高温稳定型陶瓷介质);
  • 容值规格:334K(编码规则:33×10⁴ pF=330nF);
  • 精度等级:±10%(EIA代码“K”);
  • 额定电压:50V DC;
  • 物理厚度:0.85mm(适配紧凑PCB布局)。

二、关键性能与材质特性

作为X7R介质电容,该产品的核心优势集中在温度稳定性与场景适配性:

  1. 宽温范围稳定:X7R材质的温度系数为-55℃~+125℃内,容值变化率≤±15%,远优于Y5V等低稳定介质,适合户外、工业等宽温环境;
  2. 中压覆盖性:50V额定电压覆盖消费电子(手机电源)、工业控制(PLC模块)、汽车低压辅助电路等主流场景;
  3. 精度实用平衡:±10%精度满足90%以上通用电路需求,无需过度追求NP0高精度导致成本上升,同时避免±20%精度的性能波动。

三、封装与物理规格适配性

1206封装是贴片电容的主流通用规格,具备以下适配优势:

  • 体积紧凑:3.2mm×1.6mm尺寸适合高密度PCB设计,不占用过多布线空间;
  • 焊接兼容性:支持回流焊、波峰焊等标准表面贴装工艺,焊接温度窗口宽(遵循IPC-J-STD-020标准),不易出现开裂、虚焊;
  • 厚度匹配:0.85mm厚度处于1206封装常规范围,与同封装电阻、电感高度匹配,避免PCB组装冲突。

四、典型应用场景解析

该电容因参数均衡,广泛应用于以下领域:

  1. 电源滤波:开关电源、DC-DC转换器输出滤波,抑制纹波(X7R温度稳定性确保宽温下滤波效果一致);
  2. 信号耦合:音频放大器、蓝牙射频前端的信号耦合,避免容值变化导致的信号失真;
  3. 去耦稳压:CPU、MCU周边去耦,稳定供电电压,减少瞬态波动;
  4. 工业控制:PLC、变频器辅助电路,适应-20℃~+85℃工业环境;
  5. 消费电子:智能手机、笔记本电源管理模块,满足小型化与可靠性需求。

五、品牌与可靠性保障

三环电子(CCTC)作为国内陶瓷电容资深制造商,该产品具备可靠质量保障:

  • 环保合规:符合RoHS 2.0、REACH标准,采用无铅电极,适配绿色制造;
  • 可靠性测试:通过125℃/1000h高温寿命、85℃/85%RH/1000h湿度、10~2000Hz/1.5g振动测试,满足量产稳定性;
  • 供应链稳定:成熟产能布局支持批量订单交付,降低采购风险。

六、选型与使用注意事项

为确保性能发挥,需注意以下要点:

  1. 电压余量:实际工作电压≤40V(额定电压80%),避免过压击穿;
  2. 温度边界:环境温度超125℃时,需更换X8R等高温度介质电容;
  3. 焊接控制:回流焊峰值温度≤245℃,时间≤10s,避免高温损坏介质;
  4. 精度匹配:需±5%精度时,确认同系列高精度型号,该产品仅满足±10%通用需求。

该产品凭借“X7R稳定介质+1206通用封装+50V中压”的组合,成为中低压电路的高性价比选型,适配多领域量产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.