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CCTC TCC0805X5R476M100FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- CCTC TCC0805X5R476M100FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X5R476M100FT
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0265084172
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X5R476M100FT 产品概述
一、产品简介
TCC0805X5R476M100FT 是 CCTC（三环）推出的一款贴片多层陶瓷电容（MLCC），标称容值 47µF，公差 ±20%，额定电压 10V，介电材料为 X5R，封装规格 0805（公制 2012），厚度约 1.25mm。该器件为无极性电容，适用于对体积、可靠性有较高要求的表面贴装应用。
二、主要参数
- 容值：47µF
- 容差：±20%（M）
- 额定电压：10V
- 介电类型：X5R
- 封装：0805（2012）
- 厚度：1.25mm（典型）
- 结构：多层陶瓷（MLCC）
三、主要特性
- 体积小、容量高：在 0805 封装中提供较大电容量，便于在空间受限的 PCB 上实现去耦与储能。
- 良好温度稳定性：X5R 介电材料在常用工作温度范围内性能稳定，适应温度范围宽。
- 低直流等效电阻与低串联电感，适合高频去耦与电源滤波。
- 非极性，支持双向使用，兼容回流焊工艺。
四、典型应用
- 电源去耦与旁路，尤其是单片机、FPGA、射频模块等电源入口处的储能与短路电流抑制。
- 功率管理模块与稳压器输入/输出端的滤波。
- 消费电子、通信设备、工业控制与汽车电子（根据具体认证需求确认）等领域中对体积与容量有平衡要求的电路。
五、封装与安装注意
- 推荐采用标准回流焊工艺；焊盘设计应遵循生产工艺规范以降低机械应力。
- 由于 MLCC 在高静态直流偏压下会发生电容值衰减（DC-bias 效应），设计时应评估在工作电压下的实际有效容量。
- 避免在装配过程中产生弯曲或剪切应力，必要时在敏感区域采取应力缓解措施（如加大过孔间距或使用柔性基板）。
六、性能与可靠性提示
- X5R 属中等稳定性介质，随温度和电压会有一定的容量变化；在高温或高偏压场景下请做电容随工况的实测验证。
- 建议在关键电源线路做冗余设计或并联多只以提高可靠性与降低 ESR/ESL。
- 大容量 MLCC 对焊接热循环较敏感，批量生产应配合可靠性测试（如温度循环、湿热试验等）。
七、选型建议与替代说明
- 选型时除标称容量与电压外，应重点参考 DC-bias 曲线、温漂曲线及尺寸厚度是否满足 PCB 空间限制。
- 可参考同类型 0805 X5R 47µF/10V 的其他厂商产品作为替代，但需确认厚度、偏压特性和封装一致性以保证可互换性。
八、包装与订购信息
- 常见包装方式为卷带装（Tape & Reel），适合 SMT 自动贴装。
- 订购前请与供应商确认最小包装量、交期及是否提供样品以便在目标电路中做验证。
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