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CCTC TCC0805X5R226K160FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- CCTC TCC0805X5R226K160FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X5R226K160FT
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0264859148
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X5R226K160FT 产品概述
一、产品简介
TCC0805X5R226K160FT 是三环（CCTC）推出的一款贴片多层陶瓷电容（MLCC），标称容量 22µF，精度 ±10%（K），额定电压 16V，介质为 X5R，封装为 0805（2012公制，约 2.0×1.25 mm），厚度 1.25 mm。该型号适用于对体积、容量与成本有综合要求的中短路去耦与滤波场合。
二、主要参数
- 容值：22 µF
- 精度：±10%（K）
- 额定电压：16 V DC
- 介质类型：X5R（中等温度稳定性）
- 封装：0805（2012）
- 厚度：1.25 mm
- 封装形式：贴片（可提供盘带供 SMT 回流贴装）
三、性能特点
- 单位体积内较高电容值，适合电源旁路与储能。
- X5R 介质在 −55°C 至 +85°C 温度范围内工作，容量随温度变化相对可控，适用于一般商用电子产品。
- 低等效串联电阻（ESR）与低等效串联电感（ESL），对高频去耦和降纹波效果良好。
- 0805 尺寸兼顾装配可靠性与 PCB 布局密度，厚度 1.25 mm 有利于提高额定电容量级。
四、典型应用场景
- 开关电源输出与输入侧去耦、储能。
- MCU、FPGA、SoC 的电源去耦与旁路。
- 滤波电路、模拟前端旁路与稳压器输出滤波。
- 移动设备、工业控制板、消费电子等体积有限但需较大电容的场合。
五、封装与安装建议
- 建议采用标准 SMT 回流工艺，按制造商数据手册确认回流温度曲线（符合 J-STD-020 要求）。
- 焊盘设计应匹配 0805 推荐焊盘，避免过大焊盘导致裂纹应力集中。
- 避免在 PCB 装配后对元件区域施加机械弯曲或冲击，以减少裂纹风险。
- 对于重要电压稳定性场合，请在实际 DC 偏置下测量有效容量并留裕量，因为 X5R 在较高直流偏压下容量会下降。
六、选型与注意事项
- 若工作电压或纹波较高，需考虑电容在 DC 偏压下的有效容量，必要时选用更高额定电压或更大体积型号。
- X5R 虽适用于多数商用场合，但对极端温度或长期高可靠性（如汽车、航空）应确认相应认证或选用 AEC-Q200/军规件。
- 关注封装高度与 PCB 布局高度限额，1.25 mm 厚度需在机械干涉上预留空间。
七、可靠性与储存
- 储存时避免高温高湿环境，开盘后建议尽快贴装，防潮防尘。
- 常规环境使用寿命受温度、偏压和频繁热循环影响，关键应用建议通过样机测试验证长期性能。
如需进一步的电气图表（DC 偏压曲线、温漂曲线）、焊接工艺参数或样品与报价信息，请提供 PCB 使用环境与电路要求，以便给出更精确的建议。
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