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CCTC TCC0805X5R475M250FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805X5R475M250FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X5R475M250FT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0263665796
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X5R475M250FT 产品概述
一、产品简介
TCC0805X5R475M250FT 为 CCTC（三环）出品的一款贴片多层陶瓷电容（MLCC），标称容量 4.7µF，公差 ±20%，额定电压 25V，介质类型 X5R，封装为 0805（约 2.0 × 1.25 mm）。该器件适用于表面贴装工艺，兼具体积小、等效串联电阻（ESR）低与响应速度快等特点，常用于现代消费电子、电源电路与模块化设计中作为去耦、滤波与储能元件。
二、主要技术参数
- 容值：4.7µF（标称）
- 公差：±20%（M）
- 额定电压：25V DC
- 介质：X5R（适用温度范围 -55℃ 至 +85℃）
- 封装：0805（尺寸约 2.0×1.25 mm，厚度约 0.5 mm）
- 封装形式：片式（SMD/SMT）
- 特性：低 ESR、良好瞬态响应
三、关键性能与注意事项
- 温度特性：X5R 介质在规定温度范围内容量保持良好稳定性，但相对于 NP0/C0G 仍存在一定温漂与非线性。
- 直流偏压效应：高介电常数材料在施加工作电压时会出现容量降额，设计时需考虑实际工作电压下的有效容量。
- 频率响应：适合高频去耦与电源旁路，能有效抑制电源干扰与瞬态尖峰。
- 耐久性与可靠性：适配常规回流焊工艺，按规范存储可保证长期可靠性。
四、典型应用场景
- DC-DC 转换器输入/输出去耦与能量储存
- PCB 电源平面旁路与去耦
- 手机、平板、智能家电等便携式设备电源滤波
- 模拟/数字混合电路的局部去耦与噪声抑制
五、选型与装配建议
- 若电路对容量稳定性要求高（随电压或温度变化敏感），建议评估实际工作条件下的有效容量并做裕量设计。
- 推荐遵循典型回流焊曲线（预热、均热、峰值温度与回流时间）以避免热冲击；峰值温度一般不超过 260℃。
- 贴装时注意避免过度弯曲 PCB 或在焊接后立即进行剧烈温度变化，以防裂纹和电容失效。
- 存储时保持干燥、密封包装，防止潮湿污染影响再流焊性能。
六、替代与配套
- 可在同等封装、相近容量和电压等级的 MLCC 中选择替代型号，替代时注意介质特性（X5R）与直流偏压行为的一致性。
- 在需要更高容量稳定性或更小温漂的场合，可考虑更高电压规格或不同介质（如 X7R、NP0）以满足系统要求。
总结：TCC0805X5R475M250FT 提供了在空间受限电路中可靠的去耦与滤波解决方案，适合绝大多数消费与工业级电源应用，选型时应综合考虑电压、温度与偏压下的实际容量表现。
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