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CCTC TCC0603X7R222M500CT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- CCTC TCC0603X7R222M500CT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0603X7R222M500CT
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0264527801
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X7R222M500CT 产品概述
一、概述
TCC0603X7R222M500CT 为三环（CCTC）品牌的一款多层陶瓷电容（MLCC），封装为0603（1608公制），额定容值为2.2nF（222），容差±20%（M），额定工作电压50V，介质类型为X7R。产品适用于一般去耦、滤波、耦合与旁路等印制板贴片应用场景，兼容无铅回流焊工艺。
二、关键参数
- 容值：2.2nF（表示为222）
- 容差：±20%（M）
- 额定电压：50V DC
- 封装：0603（0.06英寸）
- 介质：X7R（常温下具有较好的温度特性）
- 典型测量条件：厂方常在1MHz或1kHz条件下给出标称值，具体以数据手册为准
三、产品特点
- 小尺寸、高密度：0603 封装适合高密度贴片设计与空间受限电路板。
- 稳定性平衡：X7R 介质在-55°C至+125°C范围内保持相对稳定，适合一般温度变化环境。
- 制程兼容：适用于常见的无铅回流焊工艺与自动贴装流程。
- 通用性强：适合宽泛的通用电子产品与工业类电路应用。
四、典型应用
- 电源去耦与旁路（尤其中高频段）
- EMI/RFI 滤波器件
- 信号耦合与阻容网络
- 通信终端、消费电子、汽车电子（非关键安全回路）与工业控制等场景
五、电气特性与设计注意
- 直流偏压效应：X7R 型 MLCC 在施加较高直流电压或高场强时会产生显著的容量下降，设计时应考虑直流偏压带来的有效容值降低，并参考厂方 DC‑bias 曲线。
- 温度特性：X7R 在额定温度范围内表现良好，但非用于高精度定时或高稳定度要求的场合。
- 等效电路：实际器件包含电容C、等效串联电阻ESR 与等效串联电感ESL；在高频应用中需综合考虑 ESR/ESL 对响应的影响。
六、PCB 布局与焊接建议
- 贴近电源引脚放置以最小化走线电感与回路面积。
- 对去耦电容两端使用短、粗的走线；必要时采用多过孔接地以降低回流阻抗。
- 回流焊炉温建议遵循无铅工艺曲线，峰值温度通常不超过260°C。避免重复过高温度循环以降低破损风险。
- 储存时防潮包装打开后建议按厂方MSL等级控制贴片使用周期。
七、选型与采购建议
- 若电路对容差或温漂有更高要求，可考虑更精密容差（±10%或±5%）或NP0/C0G 类陶瓷。
- 对直流偏压敏感的场合可通过增大额定电压或改用其他介质来减小容量下降。
- 具体电性能、可靠性数据与封装焊盘建议请以厂方正式数据手册为准，并在批量采购前索取样品与可靠性测试报告验证。
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